| 12512396 |
Flexible die to floor planning with bump pitch scale through glass core via pitch |
Srinivas V. Pietambaram, Tarek A. Ibrahim, Aleksandar Aleksov, Telesphor Kamgaing |
2025-12-30 |
|
| 12436912 |
Disaggregated die with input/output (I/O) tiles |
Mahesh Kumashikar, Srikanth Nimmagadda |
2025-10-07 |
|
| 12388019 |
Pitch translation architecture for semiconductor package including embedded interconnect bridge |
Bharat P. Penmecha, Rajasekaran Swaminathan, Ram Viswanath |
2025-08-12 |
|
| 12347780 |
Integrated circuit package with flipped high bandwidth memory device |
Krishna Vasanth Valavala, Chandra Mohan Jha, Omkar G. Karhade |
2025-07-01 |
|
| 12205924 |
Semiconductor packages with chiplets coupled to a memory device |
Jianyong Xie |
2025-01-21 |
|
| 12051647 |
Pitch translation architecture for semiconductor package including embedded interconnect bridge |
Bharat P. Penmecha, Rajasekaran Swaminathan, Ram Viswanath |
2024-07-30 |
$27,313,000 |
| 12046568 |
Capacitor die embedded in package substrate for providing capacitance to surface mounted die |
Sujit Sharan, Jianyong Xie |
2024-07-23 |
$20,446,000 |
| 11728294 |
Capacitor die embedded in package substrate for providing capacitance to surface mounted die |
Sujit Sharan, Jianyong Xie |
2023-08-15 |
$18,845,000 |
| 11705390 |
Variable in-plane signal to ground reference configurations |
Arghya Sain |
2023-07-18 |
$21,060,000 |
| 11705398 |
Pitch translation architecture for semiconductor package including embedded interconnect bridge |
Bharat P. Penmecha, Rajasekaran Swaminathan, Ram Viswanath |
2023-07-18 |
$21,060,000 |
| 11621223 |
Interconnect hub for dies |
Sujit Sharan, Jianyong Xie |
2023-04-04 |
$21,090,000 |
| 11610862 |
Semiconductor packages with chiplets coupled to a memory device |
Jianyong Xie |
2023-03-21 |
$20,076,000 |
| 11569173 |
Bridge hub tiling architecture |
Digvijay A. Raorane, Wilfred Gomes, Ravindranath V. Mahajan, Sujit Sharan |
2023-01-31 |
$11,941,000 |
| 11562993 |
Embedded memory device and method for embedding memory device in a substrate |
— |
2023-01-24 |
$19,543,000 |
| 11462521 |
Multilevel die complex with integrated discrete passive components |
Jianyong Xie, Sujit Sharan |
2022-10-04 |
$13,460,000 |
| 11456281 |
Architecture and processes to enable high capacity memory packages through memory die stacking |
Yi Li, Zhiguo Qian, Prasad Ramanathan, Saikumar Jayaraman, Kemal Aygun +3 more |
2022-09-27 |
$23,391,000 |
| 11387187 |
Embedded very high density (VHD) layer |
Jianyong Xie, Sujit Sharan, Henning Braunisch, Aleksandar Aleksov |
2022-07-12 |
$13,106,000 |
| 11270942 |
Pitch translation architecture for semiconductor package including embedded interconnect bridge |
Bharat P. Penmecha, Rajasekaran Swaminathan, Ram Viswanath |
2022-03-08 |
$16,017,000 |
| 11222837 |
Low-inductance current paths for on-package power distributions and methods of assembling same |
Jianyong Xie, Sujit Sharan |
2022-01-11 |
$33,310,000 |
| 11195805 |
Capacitor die embedded in package substrate for providing capacitance to surface mounted die |
Sujit Sharan, Jianyong Xie |
2021-12-07 |
$28,128,000 |
| 11018124 |
Embedded memory device and method for embedding memory device in a substrate |
— |
2021-05-25 |
$32,857,000 |
| 10847467 |
Power-delivery methods for embedded multi-die interconnect bridges and methods of assembling same |
Debendra Mallik, Mathew J. Manusharow, Jianyong Xie |
2020-11-24 |
$25,522,000 |
| 10651117 |
Low-inductance current paths for on-package power distributions and methods of assembling same |
Jianyong Xie, Sujit Sharan |
2020-05-12 |
$29,489,000 |
| 10643945 |
Pitch translation architecture for semiconductor package including embedded interconnect bridge |
Bharat P. Penmecha, Rajasekaran Swaminathan, Ram Viswanath |
2020-05-05 |
$29,615,000 |
| 10490503 |
Power-delivery methods for embedded multi-die interconnect bridges and methods of assembling same |
Debendra Mallik, Mathew J. Manusharow, Jianyong Xie |
2019-11-26 |
$25,149,000 |
