Issued Patents All Time
Showing 25 most recent of 26 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12388019 | Pitch translation architecture for semiconductor package including embedded interconnect bridge | Bharat P. Penmecha, Rajasekaran Swaminathan, Ram Viswanath | 2025-08-12 |
| 12347780 | Integrated circuit package with flipped high bandwidth memory device | Krishna Vasanth Valavala, Chandra Mohan Jha, Omkar G. Karhade | 2025-07-01 |
| 12205924 | Semiconductor packages with chiplets coupled to a memory device | Jianyong Xie | 2025-01-21 |
| 12051647 | Pitch translation architecture for semiconductor package including embedded interconnect bridge | Bharat P. Penmecha, Rajasekaran Swaminathan, Ram Viswanath | 2024-07-30 |
| 12046568 | Capacitor die embedded in package substrate for providing capacitance to surface mounted die | Sujit Sharan, Jianyong Xie | 2024-07-23 |
| 11728294 | Capacitor die embedded in package substrate for providing capacitance to surface mounted die | Sujit Sharan, Jianyong Xie | 2023-08-15 |
| 11705390 | Variable in-plane signal to ground reference configurations | Arghya Sain | 2023-07-18 |
| 11705398 | Pitch translation architecture for semiconductor package including embedded interconnect bridge | Bharat P. Penmecha, Rajasekaran Swaminathan, Ram Viswanath | 2023-07-18 |
| 11621223 | Interconnect hub for dies | Sujit Sharan, Jianyong Xie | 2023-04-04 |
| 11610862 | Semiconductor packages with chiplets coupled to a memory device | Jianyong Xie | 2023-03-21 |
| 11569173 | Bridge hub tiling architecture | Digvijay A. Raorane, Wilfred Gomes, Ravindranath V. Mahajan, Sujit Sharan | 2023-01-31 |
| 11562993 | Embedded memory device and method for embedding memory device in a substrate | — | 2023-01-24 |
| 11462521 | Multilevel die complex with integrated discrete passive components | Jianyong Xie, Sujit Sharan | 2022-10-04 |
| 11456281 | Architecture and processes to enable high capacity memory packages through memory die stacking | Yi Li, Zhiguo Qian, Prasad Ramanathan, Saikumar Jayaraman, Kemal Aygun +3 more | 2022-09-27 |
| 11387187 | Embedded very high density (VHD) layer | Jianyong Xie, Sujit Sharan, Henning Braunisch, Aleksandar Aleksov | 2022-07-12 |
| 11270942 | Pitch translation architecture for semiconductor package including embedded interconnect bridge | Bharat P. Penmecha, Rajasekaran Swaminathan, Ram Viswanath | 2022-03-08 |
| 11222837 | Low-inductance current paths for on-package power distributions and methods of assembling same | Jianyong Xie, Sujit Sharan | 2022-01-11 |
| 11195805 | Capacitor die embedded in package substrate for providing capacitance to surface mounted die | Sujit Sharan, Jianyong Xie | 2021-12-07 |
| 11018124 | Embedded memory device and method for embedding memory device in a substrate | — | 2021-05-25 |
| 10847467 | Power-delivery methods for embedded multi-die interconnect bridges and methods of assembling same | Debendra Mallik, Mathew J. Manusharow, Jianyong Xie | 2020-11-24 |
| 10651117 | Low-inductance current paths for on-package power distributions and methods of assembling same | Jianyong Xie, Sujit Sharan | 2020-05-12 |
| 10643945 | Pitch translation architecture for semiconductor package including embedded interconnect bridge | Bharat P. Penmecha, Rajasekaran Swaminathan, Ram Viswanath | 2020-05-05 |
| 10490503 | Power-delivery methods for embedded multi-die interconnect bridges and methods of assembling same | Debendra Mallik, Mathew J. Manusharow, Jianyong Xie | 2019-11-26 |
| 10015878 | Decoupling arrangement | William L. Barber, Keith Pinson, Boping Wu, Isaac Ali, Colin L. Perry | 2018-07-03 |
| 9225164 | Decoupling arrangement | William L. Barber, Keith Pinson, Boping Wu, Isaac Ali, Colin L. Perry | 2015-12-29 |