| 12347780 |
Integrated circuit package with flipped high bandwidth memory device |
Krishna Vasanth Valavala, Andrew Collins, Omkar G. Karhade |
2025-07-01 |
|
| 12341080 |
Semiconductor device stack-up with bulk substrate material to mitigate hot spots |
Shrenik Kothari, Weihua Tang, Robert L. Sankman, Xavier Francois Brun, Pooya Tadayon |
2025-06-24 |
|
| 12205915 |
Microelectronic package with solder array thermal interface material (SA-TIM) |
Debendra Mallik, Sergio Antonio Chan Arguedas, Jimin Yao |
2025-01-21 |
|
| 12191220 |
Hybrid interposer of glass and silicon to reduce thermal crosstalk |
Zhimin Wan, Je-Young Chang, Chia-Pin Chiu |
2025-01-07 |
|
| 12021016 |
Thermally enhanced silicon back end layers for improved thermal performance |
Pooya Tadayon, Aastha Uppal, Weihua Tang, Paul Diglio, Xavier Francois Brun |
2024-06-25 |
$22,163,000 |
| 11978689 |
Semiconductor device stack-up with bulk substrate material to mitigate hot spots |
Shrenik Kothari, Weihua Tang, Robert L. Sankman, Xavier Francois Brun, Pooya Tadayon |
2024-05-07 |
$26,756,000 |
| 11894282 |
Vented lids for integrated circuit packages |
Zhimin Wan, Sergio Antonio Chan Arguedas, Peng Li, Aravindha R. Antoniswamy, Cheng Xu +2 more |
2024-02-06 |
$35,892,000 |
| 11854932 |
Package wrap-around heat spreader |
Feras Eid, Je-Young Chang |
2023-12-26 |
$39,948,000 |
| 11837519 |
Heatsink cutout and insulating through silicon vias to cut thermal cross-talk |
Zhimin Wan, Chia-Pin Chiu |
2023-12-05 |
$33,749,000 |
| 11756860 |
Semiconductor device stack-up with bulk substrate material to mitigate hot spots |
Shrenik Kothari, Weihua Tang, Robert L. Sankman, Xavier Francois Brun, Pooya Tadayon |
2023-09-12 |
$19,004,000 |
| 11756856 |
Package architecture including thermoelectric cooler structures |
Krishna Vasanth Valavala, Ravindranath V. Mahajan, Kelly Lofgreen, Weihua Tang |
2023-09-12 |
$19,004,000 |
| 11735552 |
Microelectronic package with solder array thermal interface material (SA-TIM) |
Debendra Mallik, Sergio Antonio Chan Arguedas, Jimin Yao |
2023-08-22 |
$16,803,000 |
| 11705417 |
Backside metallization (BSM) on stacked die packages and external silicon at wafer level, singulated die level, or stacked dies level |
Prasad Ramanathan, Xavier Francois Brun, Jimmin Yao, Mark R. Allen |
2023-07-18 |
$21,060,000 |
| 11694942 |
Annular silicon-embedded thermoelectric cooling devices for localized on-die thermal management |
Kelly Lofgreen, Krishna Vasanth Valavala |
2023-07-04 |
|
| 11670561 |
3D buildup of thermally conductive layers to resolve die height differences |
Zhimin Wan, Je-Young Chang, Chia-Pin Chiu, Liwei Wang |
2023-06-06 |
$21,341,000 |
| 11664293 |
Solid state thermoelectric cooler in silicon backend layers for fast cooling in turbo scenarios |
Krishna Vasanth Valavala, Ravindranath V. Mahajan |
2023-05-30 |
$16,378,000 |
| 11658095 |
Bump integrated thermoelectric cooler |
Kelly Lofgreen, Krishna Vasanth Valavala |
2023-05-23 |
$11,397,000 |
| 11626395 |
Thermal spreading management of 3D stacked integrated circuits |
Robert L. Sankman, Pooya Tadayon, Weihua Tang, Zhimin Wan |
2023-04-11 |
$27,486,000 |
| 11587843 |
Thermal bump networks for integrated circuit device assemblies |
Prasad Ramanathan, Nicholas Neal |
2023-02-21 |
$13,703,000 |
| 11521914 |
Microelectronic assemblies having a cooling channel |
Zhimin Wan, Cheng Xu, Yikang Deng, Junnan Zhao, Ying Wang +3 more |
2022-12-06 |
$14,727,000 |
| 11508645 |
Modular technique for die-level liquid cooling |
Je-Young Chang |
2022-11-22 |
$12,862,000 |
| 11502017 |
Effective heat conduction from hotspot to heat spreader through package substrate |
Cheng Xu, Zhimin Wan, Lingtao Liu, Yikang Deng, Junnan Zhao +1 more |
2022-11-15 |
$16,955,000 |
| 11462457 |
Using a thermoelectric cooler to reduce heat transfer between heat-conducting plates |
Krishna Vasanth Valavala, Kelly Lofgreen |
2022-10-04 |
$13,460,000 |
| 11456232 |
Thermal assemblies for multi-chip packages |
Zhimin Wan, Je-Young Chang, Chia-Pin Chiu, Shankar Devasenathipathy, Betsegaw K. Gebrehiwot |
2022-09-27 |
$23,391,000 |
| 11398414 |
Sloped metal features for cooling hotspots in stacked-die packages |
Zhimin Wan, Chia-Pin Chiu, Pooya Tadayon, Joe Walczyk, Weihua Tang +2 more |
2022-07-26 |
$27,041,000 |