Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Solid state thermoelectric cooler in silicon backend layers for fast cooling in turbo scenarios

Solid state thermoelectric cooler in silicon backend layers for fast cooling in turbo scenarios

US Patent 11664293 · Granted May 30, 2023

Estimated economic value: $16,378,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Package architecture of photonic system with vertically stacked dies having plan2025
Package architecture of scalable compute wall having compute bricks with vertica2025
BGA stiffener attachment with low Eolife adhesive strength at high solder joint 2025
Moisture seal coating of hybrid bonded stacked die package assembly2025
Photonic integrated circuit packaging architectures2025
Heat dissipation structures for optical communication devices2025
Integrated circuit package with flipped high bandwidth memory device2025
Integrated circuit package with flipped high bandwidth memory device2025
Interconnect architecture with silicon interposer and EMIB2025
Semiconductor device stack-up with bulk substrate material to mitigate hot spots2025
Heterogeneous nested interposer package for IC chips2025
Nested architectures for enhanced heterogeneous integration2025