| 12048123 |
Heat dissipation device having shielding/containment extensions |
Je-Young Chang, Ravindranath V. Mahajan |
2024-07-23 |
| 12021016 |
Thermally enhanced silicon back end layers for improved thermal performance |
Chandra Mohan Jha, Pooya Tadayon, Weihua Tang, Paul Diglio, Xavier Francois Brun |
2024-06-25 |
| 11830783 |
Embedded substrate heat sink for bottom side cooling |
Divya Mani, Je-Young Chang |
2023-11-28 |
| 11769753 |
Thermally-optimized tunable stack in cavity package-on-package |
George Vakanas, Shereen ELHALAWATY, Aaron McCann, Edvin Cetegen, Tannaz Harirchian +1 more |
2023-09-26 |
| 11735495 |
Active package cooling structures using molded substrate packaging technology |
Omkar G. Karhade, Mitul Modi, Edvin Cetegen |
2023-08-22 |
| 11721607 |
Integrated circuit assemblies having metal foam structures |
Je-Young Chang |
2023-08-08 |
| 11676883 |
Thermoelectric coolers combined with phase-change material in integrated circuit packages |
Javed Shaikh, Je-Young Chang, Kelly Lofgreen, Weihua Tang |
2023-06-13 |
| 11664294 |
Phase change materials for electromagnetic interference shielding and heat dissipation in integrated circuit assemblies |
Je-Young Chang, Weihua Tang, Minseok Ha |
2023-05-30 |
| 11574851 |
Coupled cooling fins in ultra-small systems |
Omkar G. Karhade, Ram Viswanath, Je-Young Chang, Weihua Tang, Nitin A. Deshpande +6 more |
2023-02-07 |
| 11545407 |
Thermal management solutions for integrated circuit packages |
Kumar Abhishek Singh, Omkar G. Karhade, Nitin A. Deshpande, Mitul Modi, Edvin Cetegen +8 more |
2023-01-03 |
| 11387175 |
Interposer package-on-package (PoP) with solder array thermal contacts |
Debendra Mallik, Sanka Ganesan, Pilin Liu, Shawna M. Liff, Sri Chaitra Jyotsna Chavali +2 more |
2022-07-12 |
| 10600699 |
Apparatus for inspection of a package assembly with a thermal solution |
Je-Young Chang, Shankar Devasenathipathy, Joseph B. Petrini |
2020-03-24 |