Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11842944 | IC assemblies including die perimeter frames suitable for containing thermal interface materials | Kyle Arrington, Frederick Atadana, Taylor Gaines | 2023-12-12 | $45,136,000 |
| 11664294 | Phase change materials for electromagnetic interference shielding and heat dissipation in integrated circuit assemblies | Aastha Uppal, Je-Young Chang, Weihua Tang | 2023-05-30 | $16,378,000 |