Issued Patents All Time
Showing 26–36 of 36 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11387224 | Phase change material in substrate cavity | Cheng Xu, Zhimin Wan, Yikang Deng, Junnan Zhao, Chong Zhang +2 more | 2022-07-12 |
| 11322456 | Die back side structures for warpage control | Feras Eid, Venkata Suresh R. Guthikonda, Shankar Devasenathipathy, Je-Young Chang, Kyle Yazzie +2 more | 2022-05-03 |
| 11127727 | Thermal spreading management of 3D stacked integrated circuits | Robert L. Sankman, Pooya Tadayon, Weihua Tang, Zhimin Wan | 2021-09-21 |
| 10607909 | Systems, methods, and apparatuses for implementing a thermal solution for 3D packaging | Purushotham Kaushik Muthur Srinath, Pramod Malatkar, Sairam Agraharam, Arnab Choudhury, Nachiket R. Raravikar | 2020-03-31 |
| 10541190 | Stacked die package with through-mold thermally conductive structures between a bottom die and a thermally conductive material | Eric J. Li | 2020-01-21 |
| 10461011 | Microelectronics package with an integrated heat spreader having indentations | Nicholas Neal, David W. Mendel, Kelly Lofgreen | 2019-10-29 |
| 10290561 | Thermal interfaces for integrated circuit packages | Edvin Cetegen, Omkar G. Karhade, Kedar Dhane | 2019-05-14 |
| 10121722 | Architecture material and process to improve thermal performance of the embedded die package | Eric J. Li, Zhaozhi Li, Robert M. Nickerson | 2018-11-06 |
| 9865521 | Copper nanorod-based thermal interface material (TIM) | Feras Eid, Johanna M. Swan, Ashish Gupta | 2018-01-09 |
| 9601406 | Copper nanorod-based thermal interface material (TIM) | Feras Eid, Johanna M. Swan, Ashish Gupta | 2017-03-21 |
| 9530718 | DBF film as a thermal interface material | Hitesh Arora, Mihir A. Oka | 2016-12-27 |