| 12381770 |
Systems and methods for transmitting and receiving auxiliary data |
— |
2025-08-05 |
|
| 12191893 |
Seemingly monolithic interface between separate integrated circuit die |
Jeffrey Erik Schulz, Keith Duwel, Huy Ngo, Jakob Raymond Jones |
2025-01-07 |
|
| 12135667 |
Interface bridge between integrated circuit die |
Jeffrey Erik Schulz, Dinesh Patil, Gary Brian Wallichs, Keith Duwel, Jakob Raymond Jones |
2024-11-05 |
|
| 12086088 |
Multichip package with protocol-configurable data paths |
Huy Ngo, Keith Duwel |
2024-09-10 |
|
| 11693810 |
Interface bridge between integrated circuit die |
Jeffrey Erik Schulz, Dinesh Patil, Gary Brian Wallichs, Keith Duwel, Jakob Raymond Jones |
2023-07-04 |
|
| 11669479 |
Multichip package with protocol-configurable data paths |
Huy Ngo, Keith Duwel |
2023-06-06 |
|
| 11349587 |
Generating a timestamp |
Nigel Antoine Gulstone, Sita Rama Chandrasekhar Mallela, Rajiv Kane |
2022-05-31 |
$16,893,000 |
| 11294842 |
Multichip package with protocol-configurable data paths |
Huy Ngo, Keith Duwel |
2022-04-05 |
|
| 11237998 |
Interface bridge between integrated circuit die |
Jeffrey Erik Schulz, Dinesh Patil, Gary Brian Wallichs, Keith Duwel, Jakob Raymond Jones |
2022-02-01 |
$16,992,000 |
| 11115025 |
Universal transceiver container |
Sergey Shumarayev, Joel Martinez, Curt Wortman |
2021-09-07 |
$31,495,000 |
| 11100029 |
Interface bridge between integrated circuit die |
Jeffrey Erik Schulz, Dinesh Patil, Gary Brian Wallichs, Keith Duwel, Jakob Raymond Jones |
2021-08-24 |
$32,164,000 |
| 11075648 |
Seemingly monolithic interface between separate integrated circuit die |
Jeffrey Erik Schulz, Keith Duwel, Huy Ngo, Jakob Raymond Jones |
2021-07-27 |
$27,337,000 |
| 10884964 |
Multichip package with protocol-configurable data paths |
Huy Ngo, Keith Duwel |
2021-01-05 |
|
| 10699045 |
Methods and apparatus for regulating the supply voltage of an integrated circuit |
Khong Seng Foo |
2020-06-30 |
|
| 10523224 |
Techniques for signal skew compensation |
Carl Ebeling, Dana How, Mahesh A. Iyer |
2019-12-31 |
|
| 10461011 |
Microelectronics package with an integrated heat spreader having indentations |
Nicholas Neal, Chandra Mohan Jha, Kelly Lofgreen |
2019-10-29 |
$25,165,000 |
| 10445278 |
Interface bridge between integrated circuit die |
Jeffrey Erik Schulz, Dinesh Patil, Gary Brian Wallichs, Keith Duwel, Jakob Raymond Jones |
2019-10-15 |
$18,012,000 |
| 10439639 |
Seemingly monolithic interface between separate integrated circuit die |
Jeffrey Erik Schulz, Keith Duwel, Huy Ngo, Jakob Raymond Jones |
2019-10-08 |
$19,521,000 |
| 10394737 |
Multichip package with protocol-configurable data paths |
Huy Ngo, Keith Duwel |
2019-08-27 |
|
| 10333535 |
Techniques for signal skew compensation |
Carl Ebeling, Dana How, Mahesh A. Iyer |
2019-06-25 |
|
| 10296479 |
Scalable circuitry and method for control insertion |
Gregg William Baeckler |
2019-05-21 |
|
| 10291442 |
Low-skew channel bonding using phase-measuring FIFO buffer |
Han Hua Leong |
2019-05-14 |
|
| 10241844 |
Techniques for heat spreading in an integrated circuit |
Rajiv Kane |
2019-03-26 |
$18,583,000 |
| 10146249 |
Adaptive rate-matching first-in first-out (FIFO) system |
Han Hua Leong, Ru Yin Ng, Geok Sun Chong |
2018-12-04 |
|
| 10068042 |
Methods and apparatus for regulating the supply voltage of an integrated circuit |
Khong Seng Foo |
2018-09-04 |
|
