Issued Patents All Time
Showing 25 most recent of 115 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12381770 | Systems and methods for transmitting and receiving auxiliary data | — | 2025-08-05 |
| 12191893 | Seemingly monolithic interface between separate integrated circuit die | Jeffrey Erik Schulz, Keith Duwel, Huy Ngo, Jakob Raymond Jones | 2025-01-07 |
| 12135667 | Interface bridge between integrated circuit die | Jeffrey Erik Schulz, Dinesh Patil, Gary Brian Wallichs, Keith Duwel, Jakob Raymond Jones | 2024-11-05 |
| 12086088 | Multichip package with protocol-configurable data paths | Huy Ngo, Keith Duwel | 2024-09-10 |
| 11693810 | Interface bridge between integrated circuit die | Jeffrey Erik Schulz, Dinesh Patil, Gary Brian Wallichs, Keith Duwel, Jakob Raymond Jones | 2023-07-04 |
| 11669479 | Multichip package with protocol-configurable data paths | Huy Ngo, Keith Duwel | 2023-06-06 |
| 11349587 | Generating a timestamp | Nigel Antoine Gulstone, Sita Rama Chandrasekhar Mallela, Rajiv Kane | 2022-05-31 |
| 11294842 | Multichip package with protocol-configurable data paths | Huy Ngo, Keith Duwel | 2022-04-05 |
| 11237998 | Interface bridge between integrated circuit die | Jeffrey Erik Schulz, Dinesh Patil, Gary Brian Wallichs, Keith Duwel, Jakob Raymond Jones | 2022-02-01 |
| 11115025 | Universal transceiver container | Sergey Shumarayev, Joel Martinez, Curt Wortman | 2021-09-07 |
| 11100029 | Interface bridge between integrated circuit die | Jeffrey Erik Schulz, Dinesh Patil, Gary Brian Wallichs, Keith Duwel, Jakob Raymond Jones | 2021-08-24 |
| 11075648 | Seemingly monolithic interface between separate integrated circuit die | Jeffrey Erik Schulz, Keith Duwel, Huy Ngo, Jakob Raymond Jones | 2021-07-27 |
| 10884964 | Multichip package with protocol-configurable data paths | Huy Ngo, Keith Duwel | 2021-01-05 |
| 10699045 | Methods and apparatus for regulating the supply voltage of an integrated circuit | Khong Seng Foo | 2020-06-30 |
| 10523224 | Techniques for signal skew compensation | Carl Ebeling, Dana How, Mahesh A. Iyer | 2019-12-31 |
| 10461011 | Microelectronics package with an integrated heat spreader having indentations | Nicholas Neal, Chandra Mohan Jha, Kelly Lofgreen | 2019-10-29 |
| 10445278 | Interface bridge between integrated circuit die | Jeffrey Erik Schulz, Dinesh Patil, Gary Brian Wallichs, Keith Duwel, Jakob Raymond Jones | 2019-10-15 |
| 10439639 | Seemingly monolithic interface between separate integrated circuit die | Jeffrey Erik Schulz, Keith Duwel, Huy Ngo, Jakob Raymond Jones | 2019-10-08 |
| 10394737 | Multichip package with protocol-configurable data paths | Huy Ngo, Keith Duwel | 2019-08-27 |
| 10333535 | Techniques for signal skew compensation | Carl Ebeling, Dana How, Mahesh A. Iyer | 2019-06-25 |
| 10296479 | Scalable circuitry and method for control insertion | Gregg William Baeckler | 2019-05-21 |
| 10291442 | Low-skew channel bonding using phase-measuring FIFO buffer | Han Hua Leong | 2019-05-14 |
| 10241844 | Techniques for heat spreading in an integrated circuit | Rajiv Kane | 2019-03-26 |
| 10146249 | Adaptive rate-matching first-in first-out (FIFO) system | Han Hua Leong, Ru Yin Ng, Geok Sun Chong | 2018-12-04 |
| 10068042 | Methods and apparatus for regulating the supply voltage of an integrated circuit | Khong Seng Foo | 2018-09-04 |