| 12191893 |
Seemingly monolithic interface between separate integrated circuit die |
David W. Mendel, Jeffrey Erik Schulz, Huy Ngo, Jakob Raymond Jones |
2025-01-07 |
|
| 12147377 |
Distributed multi-die protocol application interface |
Gary Brian Wallichs, Cora Lynn Mau |
2024-11-19 |
|
| 12135667 |
Interface bridge between integrated circuit die |
Jeffrey Erik Schulz, David W. Mendel, Dinesh Patil, Gary Brian Wallichs, Jakob Raymond Jones |
2024-11-05 |
|
| 12086088 |
Multichip package with protocol-configurable data paths |
Huy Ngo, David W. Mendel |
2024-09-10 |
|
| 11693810 |
Interface bridge between integrated circuit die |
Jeffrey Erik Schulz, David W. Mendel, Dinesh Patil, Gary Brian Wallichs, Jakob Raymond Jones |
2023-07-04 |
|
| 11669479 |
Multichip package with protocol-configurable data paths |
Huy Ngo, David W. Mendel |
2023-06-06 |
|
| 11657016 |
Distributed multi-die protocol application interface |
Gary Brian Wallichs, Cora Lynn Mau |
2023-05-23 |
|
| 11294842 |
Multichip package with protocol-configurable data paths |
Huy Ngo, David W. Mendel |
2022-04-05 |
|
| 11237998 |
Interface bridge between integrated circuit die |
Jeffrey Erik Schulz, David W. Mendel, Dinesh Patil, Gary Brian Wallichs, Jakob Raymond Jones |
2022-02-01 |
$16,992,000 |
| 11169951 |
Distributed multi-die protocol application interface |
Gary Brian Wallichs, Cora Lynn Mau |
2021-11-09 |
|
| 11100029 |
Interface bridge between integrated circuit die |
Jeffrey Erik Schulz, David W. Mendel, Dinesh Patil, Gary Brian Wallichs, Jakob Raymond Jones |
2021-08-24 |
$32,164,000 |
| 11075648 |
Seemingly monolithic interface between separate integrated circuit die |
David W. Mendel, Jeffrey Erik Schulz, Huy Ngo, Jakob Raymond Jones |
2021-07-27 |
$27,337,000 |
| 10936531 |
Distributed multi-die protocol application interface |
Gary Brian Wallichs, Cora Lynn Mau |
2021-03-02 |
|
| 10884964 |
Multichip package with protocol-configurable data paths |
Huy Ngo, David W. Mendel |
2021-01-05 |
|
| 10565155 |
Distributed multi-die protocol application interface |
Gary Brian Wallichs, Cora Lynn Mau |
2020-02-18 |
|
| 10445278 |
Interface bridge between integrated circuit die |
Jeffrey Erik Schulz, David W. Mendel, Dinesh Patil, Gary Brian Wallichs, Jakob Raymond Jones |
2019-10-15 |
$18,012,000 |
| 10439639 |
Seemingly monolithic interface between separate integrated circuit die |
David W. Mendel, Jeffrey Erik Schulz, Huy Ngo, Jakob Raymond Jones |
2019-10-08 |
$19,521,000 |
| 10404627 |
Multi-function, multi-protocol FIFO for high-speed communication |
Huy Ngo, Vinson Chan, Divya Vijayaraghavan, Curt Wortman |
2019-09-03 |
|
| 10394737 |
Multichip package with protocol-configurable data paths |
Huy Ngo, David W. Mendel |
2019-08-27 |
|
| 10348311 |
Apparatus for improving power consumption of communication circuitry and associated methods |
Curt Wortman, Michael Zheng |
2019-07-09 |
|
| 10162789 |
Distributed multi-die protocol application interface |
Gary Brian Wallichs, Cora Lynn Mau |
2018-12-25 |
|
| 9891653 |
Techniques for clock rate changes during data rate changes in an integrated circuit (IC) |
Ru Yin Ng, Gary Brian Wallichs |
2018-02-13 |
|
| 9736086 |
Multi-function, multi-protocol FIFO for high-speed communication |
Huy Ngo, Vinson Chan, Divya Vijayaraghavan, Curt Wortman |
2017-08-15 |
|
| 9595308 |
Multiple-die synchronous insertion delay measurement circuit and methods |
Gary Brian Wallichs |
2017-03-14 |
|
| 9436250 |
Apparatus for improving power consumption of communication circuitry and associated methods |
Curt Wortman, Michael Zheng |
2016-09-06 |
|
