Issued Patents All Time
Showing 25 most recent of 49 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12191893 | Seemingly monolithic interface between separate integrated circuit die | David W. Mendel, Jeffrey Erik Schulz, Huy Ngo, Jakob Raymond Jones | 2025-01-07 |
| 12147377 | Distributed multi-die protocol application interface | Gary Brian Wallichs, Cora Lynn Mau | 2024-11-19 |
| 12135667 | Interface bridge between integrated circuit die | Jeffrey Erik Schulz, David W. Mendel, Dinesh Patil, Gary Brian Wallichs, Jakob Raymond Jones | 2024-11-05 |
| 12086088 | Multichip package with protocol-configurable data paths | Huy Ngo, David W. Mendel | 2024-09-10 |
| 11693810 | Interface bridge between integrated circuit die | Jeffrey Erik Schulz, David W. Mendel, Dinesh Patil, Gary Brian Wallichs, Jakob Raymond Jones | 2023-07-04 |
| 11669479 | Multichip package with protocol-configurable data paths | Huy Ngo, David W. Mendel | 2023-06-06 |
| 11657016 | Distributed multi-die protocol application interface | Gary Brian Wallichs, Cora Lynn Mau | 2023-05-23 |
| 11294842 | Multichip package with protocol-configurable data paths | Huy Ngo, David W. Mendel | 2022-04-05 |
| 11237998 | Interface bridge between integrated circuit die | Jeffrey Erik Schulz, David W. Mendel, Dinesh Patil, Gary Brian Wallichs, Jakob Raymond Jones | 2022-02-01 |
| 11169951 | Distributed multi-die protocol application interface | Gary Brian Wallichs, Cora Lynn Mau | 2021-11-09 |
| 11100029 | Interface bridge between integrated circuit die | Jeffrey Erik Schulz, David W. Mendel, Dinesh Patil, Gary Brian Wallichs, Jakob Raymond Jones | 2021-08-24 |
| 11075648 | Seemingly monolithic interface between separate integrated circuit die | David W. Mendel, Jeffrey Erik Schulz, Huy Ngo, Jakob Raymond Jones | 2021-07-27 |
| 10936531 | Distributed multi-die protocol application interface | Gary Brian Wallichs, Cora Lynn Mau | 2021-03-02 |
| 10884964 | Multichip package with protocol-configurable data paths | Huy Ngo, David W. Mendel | 2021-01-05 |
| 10565155 | Distributed multi-die protocol application interface | Gary Brian Wallichs, Cora Lynn Mau | 2020-02-18 |
| 10445278 | Interface bridge between integrated circuit die | Jeffrey Erik Schulz, David W. Mendel, Dinesh Patil, Gary Brian Wallichs, Jakob Raymond Jones | 2019-10-15 |
| 10439639 | Seemingly monolithic interface between separate integrated circuit die | David W. Mendel, Jeffrey Erik Schulz, Huy Ngo, Jakob Raymond Jones | 2019-10-08 |
| 10404627 | Multi-function, multi-protocol FIFO for high-speed communication | Huy Ngo, Vinson Chan, Divya Vijayaraghavan, Curt Wortman | 2019-09-03 |
| 10394737 | Multichip package with protocol-configurable data paths | Huy Ngo, David W. Mendel | 2019-08-27 |
| 10348311 | Apparatus for improving power consumption of communication circuitry and associated methods | Curt Wortman, Michael Zheng | 2019-07-09 |
| 10162789 | Distributed multi-die protocol application interface | Gary Brian Wallichs, Cora Lynn Mau | 2018-12-25 |
| 9891653 | Techniques for clock rate changes during data rate changes in an integrated circuit (IC) | Ru Yin Ng, Gary Brian Wallichs | 2018-02-13 |
| 9736086 | Multi-function, multi-protocol FIFO for high-speed communication | Huy Ngo, Vinson Chan, Divya Vijayaraghavan, Curt Wortman | 2017-08-15 |
| 9595308 | Multiple-die synchronous insertion delay measurement circuit and methods | Gary Brian Wallichs | 2017-03-14 |
| 9436250 | Apparatus for improving power consumption of communication circuitry and associated methods | Curt Wortman, Michael Zheng | 2016-09-06 |