Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11921824 | Sensor data fusion using cross-modal transformer | Todd Hester, Sheng Chen, Mark Buckler, Ayan Sinha, Michael Lawrence LeKander +1 more | 2024-03-05 |
| 10472229 | Monocrystalline epitaxially aligned nanostructures and related methods | Ulrich Wiesner, Michael D. Thompson | 2019-11-12 |
| 10347281 | Structures and methods for templated growth of high areal density heat assisted magnetic recording media | Bruce Alvin Gurney, Olav Hellwig, Jodi Mari Iwata, Tiffany Santos, Dieter K. Weller +1 more | 2019-07-09 |
| 9719170 | Patterned block copolymer structure with oxide lines for line density multiplication | Ricardo Ruiz | 2017-08-01 |
| 9640415 | Robust ink formulations for durable markings on microelectronic packages and its extendibility as a barrier material for thermal and sealant materials | Randall D. Lowe, Jr., Suriyakala Ramalingam, Nisha Ananthakrishnan, James C. Matayabas, Jr., Arjun Krishnan | 2017-05-02 |
| 9530718 | DBF film as a thermal interface material | Mihir A. Oka, Chandra Mohan Jha | 2016-12-27 |
| 9464348 | Method for making a patterned perpendicular magnetic recording disk using glancing angle deposition of hard mask material | Jean-Marc Beaujour, Zuwei Liu, Tsai-Wei Wu | 2016-10-11 |
| 9431046 | Perpendicular magnetic recording disk with patterned template layer | Andrea Fasoli, Qing Zhu | 2016-08-30 |
| 9431274 | Method for reducing underfill filler settling in integrated circuit packages | Suriyakala Ramalingam, Manish Dubey, Hsin-Yu Li, Michelle S. Phen, Nisha Ananthakrishnan +3 more | 2016-08-30 |
| 9416447 | Method for line density multiplication using block copolymers and sequential infiltration synthesis | Ricardo Ruiz | 2016-08-16 |
| 9336809 | Method for making an imprint template with data regions and non-data regions using block copolymers | Sripathi Vangipuram Canchi, Franck Dreyfus Rose, Ricardo Ruiz, Vipin Ayanoor-Vitikkate | 2016-05-10 |
| 8920919 | Thermal interface material composition including polymeric matrix and carbon filler | James C. Matayabas, Jr. | 2014-12-30 |
| 8900919 | Robust ink formulations for durable markings on microelectronic packages and its extendibility as a barrier material for thermal and sealant materials | Randall D. Lowe, Jr., Suriyakala Ramalingam, Nisha Ananthakrishnan, James C. Matayabas, Jr., Arjun Krishnan | 2014-12-02 |