| 11923268 |
Printed heat spreader structures and methods of providing same |
Jesus Gerardo Reyes Schuldes, Shankar Devasenathipathy, Aravindha R. Antoniswamy, Kyle Arrington |
2024-03-05 |
$29,696,000 |
| 11916003 |
Varied ball ball-grid-array (BGA) packages |
Xiao Lu, Jiongxin Lu, Christopher Combs, Alexander HUETTIS, John Harper +5 more |
2024-02-27 |
$28,450,000 |
| 11327050 |
Mechanical failure monitoring, detection, and classification in electronic assemblies |
Kyle Yazzie, Rajesh Kumar Neerukatti, Naga Sivakumar Yagnamurthy, David C. McCoy, Frank P. Prieto |
2022-05-10 |
$19,182,000 |
| 11322456 |
Die back side structures for warpage control |
Feras Eid, Venkata Suresh R. Guthikonda, Shankar Devasenathipathy, Chandra Mohan Jha, Je-Young Chang +2 more |
2022-05-03 |
$16,346,000 |
| 11201128 |
Packaged semiconductor die with bumpless die-package interface for bumpless build-up layer (BBUL) packages |
Weng Hong Teh, John S. Guzek, Robert L. Sankman |
2021-12-14 |
$41,312,000 |
| 10985080 |
Electronic package that includes lamination layer |
Kyle Yazzie, Naga Sivakumar Yagnamurthy, Richard J. Harries, Dilan Seneviratne, Praneeth Akkinepally +3 more |
2021-04-20 |
$53,056,000 |
| 10957656 |
Integrated circuit packages with patterned protective material |
Kyle Yazzie, Naga Sivakumar Yagnamurthy, Chia-Pin Chiu, Mohit Mamodia, Mark Gallina +3 more |
2021-03-23 |
$29,278,000 |
| 10634594 |
Membrane test for mechanical testing of stretchable electronics |
Ravindranth V. Mahajan, Rajendra C. Dias, Steven A. Klein, Vijay Subramania, Aleksandar Aleksov +1 more |
2020-04-28 |
$36,717,000 |
| 10607909 |
Systems, methods, and apparatuses for implementing a thermal solution for 3D packaging |
Purushotham Kaushik Muthur Srinath, Sairam Agraharam, Chandra Mohan Jha, Arnab Choudhury, Nachiket R. Raravikar |
2020-03-31 |
$34,068,000 |
| 10499461 |
Thermal head with a thermal barrier for integrated circuit die processing |
Mohit Mamodia, Kyle Yazzie, Dingying Xu, Kuang Liu, Paul Diglio |
2019-12-03 |
$19,496,000 |
| 10475750 |
Systems, methods, and apparatuses for implementing an organic stiffener with an EMI shield for RF integration |
Vijay K. Nair |
2019-11-12 |
$21,873,000 |
| 10290569 |
Constrained cure component attach process for improved IC package warpage control |
Kyle Yazzie, Venkata Suresh R. Guthikonda, Patrick Nardi, Santosh Sankarasubramanian, Kevin Y. Lin +2 more |
2019-05-14 |
$24,469,000 |
| 10278318 |
Method of assembling an electronic component using a probe having a fluid thereon |
Kyle Yazzie, Xiao Lu, Daniel Chavez-Clemente |
2019-04-30 |
$31,713,000 |
| 10231338 |
Methods of forming trenches in packages structures and structures formed thereby |
Naga Sivakumar Yagnamurthy, Huiyang Fei, Prasanna Raghavan, Robert M. Nickerson |
2019-03-12 |
$21,255,000 |
| 10090259 |
Non-rectangular electronic device components |
Sairam Agraharam, Shawna M. Liff |
2018-10-02 |
$23,827,000 |
| 10070520 |
Magnetic particle embedded flex or printed flex for magnetic tray or electro-magnetic carrier |
Yoshihiro Tomita, Joshua D. Heppner, Shawna M. Liff |
2018-09-04 |
$19,235,000 |
| 9831213 |
Bumpless build-up layer package with pre-stacked microelectronic devices |
— |
2017-11-28 |
$12,678,000 |
| 9818719 |
Bumpless build-up layer package design with an interposer |
— |
2017-11-14 |
$11,178,000 |
| 9793225 |
Thermal expansion compensators for controlling microelectronic package warpage |
Richard J. Harries |
2017-10-17 |
$9,876,000 |
| 9661745 |
Vacuum lamination of depth-sensing camera module PCB to stiffener using built-in vacuum channels |
Kyle Yazzie |
2017-05-23 |
$7,972,000 |
| 9627227 |
Bumpless build-up layer package warpage reduction |
Drew W. Delaney |
2017-04-18 |
$8,310,000 |
| 9548284 |
Reduced expansion thermal compression bonding process bond head |
Hemanth K. Dhavaleswarapu, James Neeb |
2017-01-17 |
$15,866,000 |
| 9414484 |
Thermal expansion compensators for controlling microelectronic package warpage |
Richard J. Harries |
2016-08-09 |
$12,367,000 |
| 9362253 |
Bumpless build-up layer package with pre-stacked microelectronic devices |
— |
2016-06-07 |
$9,646,000 |
| 9224674 |
Packaged semiconductor die with bumpless die-package interface for bumpless build-up layer (BBUL) packages |
Weng Hong Teh, John S. Guzek, Robert L. Sankman |
2015-12-29 |
$8,962,000 |
