Issued Patents All Time
Showing 25 most recent of 31 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11923268 | Printed heat spreader structures and methods of providing same | Jesus Gerardo Reyes Schuldes, Shankar Devasenathipathy, Aravindha R. Antoniswamy, Kyle Arrington | 2024-03-05 |
| 11916003 | Varied ball ball-grid-array (BGA) packages | Xiao Lu, Jiongxin Lu, Christopher Combs, Alexander HUETTIS, John Harper +5 more | 2024-02-27 |
| 11327050 | Mechanical failure monitoring, detection, and classification in electronic assemblies | Kyle Yazzie, Rajesh Kumar Neerukatti, Naga Sivakumar Yagnamurthy, David C. McCoy, Frank P. Prieto | 2022-05-10 |
| 11322456 | Die back side structures for warpage control | Feras Eid, Venkata Suresh R. Guthikonda, Shankar Devasenathipathy, Chandra Mohan Jha, Je-Young Chang +2 more | 2022-05-03 |
| 11201128 | Packaged semiconductor die with bumpless die-package interface for bumpless build-up layer (BBUL) packages | Weng Hong Teh, John S. Guzek, Robert L. Sankman | 2021-12-14 |
| 10985080 | Electronic package that includes lamination layer | Kyle Yazzie, Naga Sivakumar Yagnamurthy, Richard J. Harries, Dilan Seneviratne, Praneeth Akkinepally +3 more | 2021-04-20 |
| 10957656 | Integrated circuit packages with patterned protective material | Kyle Yazzie, Naga Sivakumar Yagnamurthy, Chia-Pin Chiu, Mohit Mamodia, Mark Gallina +3 more | 2021-03-23 |
| 10634594 | Membrane test for mechanical testing of stretchable electronics | Ravindranth V. Mahajan, Rajendra C. Dias, Steven A. Klein, Vijay Subramania, Aleksandar Aleksov +1 more | 2020-04-28 |
| 10607909 | Systems, methods, and apparatuses for implementing a thermal solution for 3D packaging | Purushotham Kaushik Muthur Srinath, Sairam Agraharam, Chandra Mohan Jha, Arnab Choudhury, Nachiket R. Raravikar | 2020-03-31 |
| 10499461 | Thermal head with a thermal barrier for integrated circuit die processing | Mohit Mamodia, Kyle Yazzie, Dingying Xu, Kuang Liu, Paul Diglio | 2019-12-03 |
| 10475750 | Systems, methods, and apparatuses for implementing an organic stiffener with an EMI shield for RF integration | Vijay K. Nair | 2019-11-12 |
| 10290569 | Constrained cure component attach process for improved IC package warpage control | Kyle Yazzie, Venkata Suresh R. Guthikonda, Patrick Nardi, Santosh Sankarasubramanian, Kevin Y. Lin +2 more | 2019-05-14 |
| 10278318 | Method of assembling an electronic component using a probe having a fluid thereon | Kyle Yazzie, Xiao Lu, Daniel Chavez-Clemente | 2019-04-30 |
| 10231338 | Methods of forming trenches in packages structures and structures formed thereby | Naga Sivakumar Yagnamurthy, Huiyang Fei, Prasanna Raghavan, Robert M. Nickerson | 2019-03-12 |
| 10090259 | Non-rectangular electronic device components | Sairam Agraharam, Shawna M. Liff | 2018-10-02 |
| 10070520 | Magnetic particle embedded flex or printed flex for magnetic tray or electro-magnetic carrier | Yoshihiro Tomita, Joshua D. Heppner, Shawna M. Liff | 2018-09-04 |
| 9831213 | Bumpless build-up layer package with pre-stacked microelectronic devices | — | 2017-11-28 |
| 9818719 | Bumpless build-up layer package design with an interposer | — | 2017-11-14 |
| 9793225 | Thermal expansion compensators for controlling microelectronic package warpage | Richard J. Harries | 2017-10-17 |
| 9661745 | Vacuum lamination of depth-sensing camera module PCB to stiffener using built-in vacuum channels | Kyle Yazzie | 2017-05-23 |
| 9627227 | Bumpless build-up layer package warpage reduction | Drew W. Delaney | 2017-04-18 |
| 9548284 | Reduced expansion thermal compression bonding process bond head | Hemanth K. Dhavaleswarapu, James Neeb | 2017-01-17 |
| 9414484 | Thermal expansion compensators for controlling microelectronic package warpage | Richard J. Harries | 2016-08-09 |
| 9362253 | Bumpless build-up layer package with pre-stacked microelectronic devices | — | 2016-06-07 |
| 9224674 | Packaged semiconductor die with bumpless die-package interface for bumpless build-up layer (BBUL) packages | Weng Hong Teh, John S. Guzek, Robert L. Sankman | 2015-12-29 |