Issued Patents All Time
Showing 26–31 of 31 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9159649 | Microelectronic package and stacked microelectronic assembly and computing system containing same | Drew W. Delaney, Rahul N. Manepalli, Dilan Seneviratne | 2015-10-13 |
| 8848380 | Bumpless build-up layer package warpage reduction | Drew W. Delaney | 2014-09-30 |
| 8754516 | Bumpless build-up layer package with pre-stacked microelectronic devices | — | 2014-06-17 |
| 8580616 | Methods of forming fully embedded bumpless build-up layer packages and structures formed thereby | Ravi Kiran Nalla, Mathew J. Manusharow | 2013-11-12 |
| 8304913 | Methods of forming fully embedded bumpless build-up layer packages and structures formed thereby | Ravi Kiran Nalla, Mathew J. Manusharow | 2012-11-06 |
| 7179093 | Retractable ledge socket | Nicholas Holmberg, John J. Beatty | 2007-02-20 |