Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10375832 | Method of forming an interference shield on a substrate | Digvijay A. Raorane, Kemal Aygun, Daniel N. Sobieski | 2019-08-06 |
| 9627227 | Bumpless build-up layer package warpage reduction | Pramod Malatkar | 2017-04-18 |
| 9406618 | Die-stacking using through-silicon vias on bumpless build-up layer substrates including embedded-dice, and processes of forming same | John S. Guzek, Ravi Kiran Nalla, Javier Solo Gonzalez, Suresh Pothukuchi, Mohit Mamodia +2 more | 2016-08-02 |
| 9257380 | Forming functionalized carrier structures with coreless packages | Ravi Kiran Nalla, John S. Guzek, Javier Soto Gonzalez, Hamid Azimi | 2016-02-09 |
| 9232686 | Thin film based electromagnetic interference shielding with BBUL/coreless packages | Digvijay A. Raorane, Kemal Aygun, Daniel N. Sobieski | 2016-01-05 |
| 9159649 | Microelectronic package and stacked microelectronic assembly and computing system containing same | Pramod Malatkar, Rahul N. Manepalli, Dilan Seneviratne | 2015-10-13 |
| 8987065 | Forming functionalized carrier structures with coreless packages | Ravi K. Nailla, John S. Guzek, Javier Soto Gonzalez, Hamid Azimi | 2015-03-24 |
| 8896116 | Microelectronic package and method of manufacturing same | Ravi Kiran Nalla, Mathew J. Manusharow | 2014-11-25 |
| 8848380 | Bumpless build-up layer package warpage reduction | Pramod Malatkar | 2014-09-30 |
| 8786066 | Die-stacking using through-silicon vias on bumpless build-up layer substrates including embedded-dice, and processes of forming same | John S. Guzek, Ravi Kiran Nalla, Javier Soto Gonzalez, Suresh Pothukuchi, Mohit Mamodia +2 more | 2014-07-22 |
| 8618652 | Forming functionalized carrier structures with coreless packages | Ravi Kiran Nalla, John S. Guzek, Javier Soto Gonzalez, Hamid Azimi | 2013-12-31 |
| 8507324 | Forming metal filled die back-side film for electromagnetic interference shielding with coreless packages | Ravi Kiran Nalla | 2013-08-13 |
| 8319318 | Forming metal filled die back-side film for electromagnetic interference shielding with coreless packages | Ravi Kiran Nalla | 2012-11-27 |
| 7141452 | Methods of reducing bleed-out of underfill and adhesive materials | Mahesh Sambasivam, Saeed S. Shojaie | 2006-11-28 |