Drew W. Delaney — 14 Patents at Intel

Drew W. Delaney has been granted 14 US patents while listed as an inventor at Intel. The first was granted in 2006 and the most recent in August 2019. Drew W. Delaney ranks #332,869 of 4,157,543 US inventors in our database (top 8.0%). Patent records list Drew W. Delaney in Chandler, AZ, US.

Patents per Year

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Showing 1–14 of 14 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
10375832	Method of forming an interference shield on a substrate	Digvijay A. Raorane, Kemal Aygun, Daniel N. Sobieski	2019-08-06	$15,127,000
9627227	Bumpless build-up layer package warpage reduction	Pramod Malatkar	2017-04-18	$8,310,000
9406618	Die-stacking using through-silicon vias on bumpless build-up layer substrates including embedded-dice, and processes of forming same	John S. Guzek, Ravi Kiran Nalla, Javier Solo Gonzalez, Suresh Pothukuchi, Mohit Mamodia +2 more	2016-08-02	$8,723,000
9257380	Forming functionalized carrier structures with coreless packages	Ravi Kiran Nalla, John S. Guzek, Javier Soto Gonzalez, Hamid Azimi	2016-02-09	$15,927,000
9232686	Thin film based electromagnetic interference shielding with BBUL/coreless packages	Digvijay A. Raorane, Kemal Aygun, Daniel N. Sobieski	2016-01-05	$11,513,000
9159649	Microelectronic package and stacked microelectronic assembly and computing system containing same	Pramod Malatkar, Rahul N. Manepalli, Dilan Seneviratne	2015-10-13	$14,687,000
8987065	Forming functionalized carrier structures with coreless packages	Ravi K. Nailla, John S. Guzek, Javier Soto Gonzalez, Hamid Azimi	2015-03-24	$15,411,000
8896116	Microelectronic package and method of manufacturing same	Ravi Kiran Nalla, Mathew J. Manusharow	2014-11-25	$33,083,000
8848380	Bumpless build-up layer package warpage reduction	Pramod Malatkar	2014-09-30	$16,330,000
8786066	Die-stacking using through-silicon vias on bumpless build-up layer substrates including embedded-dice, and processes of forming same	John S. Guzek, Ravi Kiran Nalla, Javier Soto Gonzalez, Suresh Pothukuchi, Mohit Mamodia +2 more	2014-07-22	$29,002,000
8618652	Forming functionalized carrier structures with coreless packages	Ravi Kiran Nalla, John S. Guzek, Javier Soto Gonzalez, Hamid Azimi	2013-12-31	$14,080,000
8507324	Forming metal filled die back-side film for electromagnetic interference shielding with coreless packages	Ravi Kiran Nalla	2013-08-13	$12,122,000
8319318	Forming metal filled die back-side film for electromagnetic interference shielding with coreless packages	Ravi Kiran Nalla	2012-11-27	$12,455,000
7141452	Methods of reducing bleed-out of underfill and adhesive materials	Mahesh Sambasivam, Saeed S. Shojaie	2006-11-28	$16,743,000

Drew W. Delaney — 14 Patents

Patents per Year

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