Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Thin film based electromagnetic interference shielding with BBUL/coreless packages

Thin film based electromagnetic interference shielding with BBUL/coreless packages

US Patent 9232686 · Granted Jan 5, 2016

Estimated economic value: $11,513,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Ground via clustering for crosstalk mitigation2025
Heterogenous socket contact for electrical and mechanical performance scaling in2025
Glass substrates having signal shielding for use with semiconductor packages and2025
Through-substrate optical vias2025
Nested architectures for enhanced heterogeneous integration2025
IC package including multi-chip unit with bonded integrated heat spreader2024
Open cavity bridge co-planar placement architectures and processes2024
Embedded bridge die with through-silicon vias2024
Optical multichip package with multiple system-on-chip dies2024
Nested architectures for enhanced heterogeneous integration2024
Minimizing package impedance discontinuity through dielectric structure optimiza2024
Dummy die structures of a packaged integrated circuit device2024