{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "Microelectronic package and method of manufacturing same", "item": "https://www.patentleaderboard.com/patent/8896116"}]}
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Home › Microelectronic package and method of manufacturing same

Microelectronic package and method of manufacturing same

US Patent 8896116 · Granted Nov 25, 2014

Estimated economic value: $33,083,000 ⓘ

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