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Home › Die-stacking using through-silicon vias on bumpless build-up layer substrates including embedded-dice, and processes of forming same

Die-stacking using through-silicon vias on bumpless build-up layer substrates including embedded-dice, and processes of forming same

US Patent 9406618 · Granted Aug 2, 2016

Estimated economic value: $8,723,000 ⓘ

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