Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Device, method and system to mitigate stress on hybrid bonds in a multi-tier arrangement of chiplets

Device, method and system to mitigate stress on hybrid bonds in a multi-tier arrangement of chiplets

US Patent 12456702 · Granted Oct 28, 2025

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Flexible die to floor planning with bump pitch scale through glass core via pitc2025
Microelectronic assemblies with communication networks2025
Microelectronic assemblies with communication networks2025
Microelectronic assemblies with communication networks2025
Packaging architecture with intermediate routing layers2025
Packaging architecture with intermediate routing layers2025
Packaging architecture with intermediate routing layers2025
Packaging architecture with intermediate routing layers2025
Substrate integrated thin film capacitors using amorphous high-k dielectrics2025
Apparatus and method of manufacturing a vertically disaggregated photonic device2025
Cooling of conformal power delivery structures2025
Cooling of conformal power delivery structures2025