Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11916003 | Varied ball ball-grid-array (BGA) packages | Xiao Lu, Christopher Combs, Alexander HUETTIS, John Harper, Jieping Zhang +5 more | 2024-02-27 |
| 11404337 | Scalable extreme large size substrate integration | Kunzhong Hu, Chonghua Zhong, Jun Zhai | 2022-08-02 |