Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11916003 | Varied ball ball-grid-array (BGA) packages | Xiao Lu, Jiongxin Lu, Christopher Combs, Alexander HUETTIS, John Harper +5 more | 2024-02-27 | $28,450,000 |
| 9508610 | Inline measurement of molding material thickness using terahertz reflectance | Shuhong Liu, Nilanjan Ghosh, Zhiyong Wang, Deepak Goyal, Shripad Gokhale | 2016-11-29 | $9,403,000 |