| 12308299 |
TEC-embedded dummy die to cool the bottom die edge hotspot |
Chia-Pin Chiu, Zhimin Wan, Peng Li |
2025-05-20 |
|
| 12271742 |
Automatically executing application routines with user inputs |
Cliff Kuang, Diana Avram, Mugurel Ionut Andreica, Radu Voroneanu, Sneha Ashok +6 more |
2025-04-08 |
|
| 12094800 |
Thermally conductive slugs/active dies to improve cooling of stacked bottom dies |
Zhimin Wan, Jin Yang, Chia-Pin Chiu, Peng Li |
2024-09-17 |
$19,251,000 |
| 11798861 |
Integrated heat spreader (IHS) with heating element |
Peng Li, Kelly Lofgreen, Manish Dubey, Bamidele Daniel Falola, Ken Hackenberg +3 more |
2023-10-24 |
$20,059,000 |
| 11791237 |
Microelectronic assemblies including a thermal interface material |
Peng Li, Sergio Antonio Chan Arguedas, Yongmei Liu, Ken Hackenberg |
2023-10-17 |
$15,641,000 |
| 11551956 |
Method and device for failure analysis using RF-based thermometry |
Chandrashekara Shashank Kaira, Phillip C. Miller, Purushotham Kaushik Muthur Srinath |
2023-01-10 |
$14,061,000 |
| 11506709 |
X-ray filter |
Mario Pacheco |
2022-11-22 |
$12,862,000 |
| 11476120 |
Method of sample preparation using dual ion beam trenching |
Purushotham Kaushik Muthur Srinath, Richard Kenneth Brewer |
2022-10-18 |
$11,317,000 |
| 11346818 |
Method, device and system for non-destructive detection of defects in a semiconductor die |
Mario Pacheco, Odissei Touzanov, Jacob Woolsey |
2022-05-31 |
$16,893,000 |
| 11281657 |
Event-driven identity graph conflation |
Giridhar Addepalli, Sébastien Péhu, Saigopal Thota, Mridul Jain, Navinder Pal Singh Brar |
2022-03-22 |
|
| 11226353 |
Integrated cable probe design for high bandwidth RF testing |
Chengqing Hu, Mayue Xie, Simranjit S. Khalsa |
2022-01-18 |
$31,898,000 |
| 11138077 |
System and method for bootstrapping replicas from active partitions |
Navinder Pal Singh Brar, Ashish Surana, Giridhar Addepalli, Sébastien Péhu |
2021-10-05 |
|
| 10935593 |
Method of resonance analysis for electrical fault isolation |
Mayue Xie, Sivaseetharaman PANDI |
2021-03-02 |
$34,569,000 |
| 10936232 |
Methods and apparatus for data repartitioning |
Ashish Surana, Navinderpal Pal Singh Brar, Giridhar Addepalli, Sébastien Péhu |
2021-03-02 |
|
| 10908206 |
Characterization of transmission media |
Mayue Xie, Chengqing Hu, Jong-Ru Guo, Zuoguo Wu |
2021-02-02 |
$28,243,000 |
| 10754518 |
Techniques for providing customized user interface components in a push notification |
Christopher Ingram Bell, Biswadeep Das, Anirban Ghosh, Tegdeep Kondal, Pradeep Bangalore Manjunathaiah +3 more |
2020-08-25 |
$258,335,000 |
| 10746780 |
High power terahertz impulse for fault isolation |
Mayue Xie, Simranjit S. Khalsa, Hemachandar Tanukonda Devarajulu, Zhiguo Qian |
2020-08-18 |
$29,577,000 |
| 10361167 |
Electronic assembly using bismuth-rich solder |
Pilin Liu, Purushotham Kaushik Muthur Srinath |
2019-07-23 |
$32,139,000 |
| 10078204 |
Non-destructive 3-dimensional chemical imaging of photo-resist material |
Nilanjan Ghosh, Kevin Thomas McCarthy, Zhiyong Wang, Changhua Liu, Leonel Arana |
2018-09-18 |
$29,867,000 |
| 9817028 |
Terahertz transmission contactless probing and scanning for signal analysis and fault isolation |
Mayue Xie, Hemachandar Tanukonda Devarajulu |
2017-11-14 |
$11,178,000 |
| 9746428 |
Inline inspection of the contact between conductive traces and substrate for hidden defects using white light interferometer with tilted objective lens |
Shuhong Liu, Zhiyong Wang, Nilanjan Ghosh |
2017-08-29 |
$8,286,000 |
| 9625256 |
Device, system and method for alignment of an integrated circuit assembly |
Purushotham Kaushik Muthur Srinath, Mario Pacheco |
2017-04-18 |
$8,310,000 |
| 9508610 |
Inline measurement of molding material thickness using terahertz reflectance |
Shuhong Liu, Nilanjan Ghosh, Zhiyong Wang, Shripad Gokhale, Jieping Zhang |
2016-11-29 |
$9,403,000 |
| 9389064 |
Inline inspection of the contact between conductive traces and substrate for hidden defects using white light interferometer with tilted objective lens |
Shuhong Liu, Zhiyong Wang, Nilanjan Ghosh |
2016-07-12 |
$10,128,000 |
| 9291576 |
Detection of defect in die |
Mario Pacheco |
2016-03-22 |
$9,243,000 |
