Issued Patents All Time
Showing 25 most recent of 32 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12308299 | TEC-embedded dummy die to cool the bottom die edge hotspot | Chia-Pin Chiu, Zhimin Wan, Peng Li | 2025-05-20 |
| 12271742 | Automatically executing application routines with user inputs | Cliff Kuang, Diana Avram, Mugurel Ionut Andreica, Radu Voroneanu, Sneha Ashok +6 more | 2025-04-08 |
| 12094800 | Thermally conductive slugs/active dies to improve cooling of stacked bottom dies | Zhimin Wan, Jin Yang, Chia-Pin Chiu, Peng Li | 2024-09-17 |
| 11798861 | Integrated heat spreader (IHS) with heating element | Peng Li, Kelly Lofgreen, Manish Dubey, Bamidele Daniel Falola, Ken Hackenberg +3 more | 2023-10-24 |
| 11791237 | Microelectronic assemblies including a thermal interface material | Peng Li, Sergio Antonio Chan Arguedas, Yongmei Liu, Ken Hackenberg | 2023-10-17 |
| 11551956 | Method and device for failure analysis using RF-based thermometry | Chandrashekara Shashank Kaira, Phillip C. Miller, Purushotham Kaushik Muthur Srinath | 2023-01-10 |
| 11506709 | X-ray filter | Mario Pacheco | 2022-11-22 |
| 11476120 | Method of sample preparation using dual ion beam trenching | Purushotham Kaushik Muthur Srinath, Richard Kenneth Brewer | 2022-10-18 |
| 11346818 | Method, device and system for non-destructive detection of defects in a semiconductor die | Mario Pacheco, Odissei Touzanov, Jacob Woolsey | 2022-05-31 |
| 11281657 | Event-driven identity graph conflation | Giridhar Addepalli, Sébastien Péhu, Saigopal Thota, Mridul Jain, Navinder Pal Singh Brar | 2022-03-22 |
| 11226353 | Integrated cable probe design for high bandwidth RF testing | Chengqing Hu, Mayue Xie, Simranjit S. Khalsa | 2022-01-18 |
| 11138077 | System and method for bootstrapping replicas from active partitions | Navinder Pal Singh Brar, Ashish Surana, Giridhar Addepalli, Sébastien Péhu | 2021-10-05 |
| 10935593 | Method of resonance analysis for electrical fault isolation | Mayue Xie, Sivaseetharaman PANDI | 2021-03-02 |
| 10936232 | Methods and apparatus for data repartitioning | Ashish Surana, Navinderpal Pal Singh Brar, Giridhar Addepalli, Sébastien Péhu | 2021-03-02 |
| 10908206 | Characterization of transmission media | Mayue Xie, Chengqing Hu, Jong-Ru Guo, Zuoguo Wu | 2021-02-02 |
| 10754518 | Techniques for providing customized user interface components in a push notification | Christopher Ingram Bell, Biswadeep Das, Anirban Ghosh, Tegdeep Kondal, Pradeep Bangalore Manjunathaiah +3 more | 2020-08-25 |
| 10746780 | High power terahertz impulse for fault isolation | Mayue Xie, Simranjit S. Khalsa, Hemachandar Tanukonda Devarajulu, Zhiguo Qian | 2020-08-18 |
| 10361167 | Electronic assembly using bismuth-rich solder | Pilin Liu, Purushotham Kaushik Muthur Srinath | 2019-07-23 |
| 10078204 | Non-destructive 3-dimensional chemical imaging of photo-resist material | Nilanjan Ghosh, Kevin Thomas McCarthy, Zhiyong Wang, Changhua Liu, Leonel Arana | 2018-09-18 |
| 9817028 | Terahertz transmission contactless probing and scanning for signal analysis and fault isolation | Mayue Xie, Hemachandar Tanukonda Devarajulu | 2017-11-14 |
| 9746428 | Inline inspection of the contact between conductive traces and substrate for hidden defects using white light interferometer with tilted objective lens | Shuhong Liu, Zhiyong Wang, Nilanjan Ghosh | 2017-08-29 |
| 9625256 | Device, system and method for alignment of an integrated circuit assembly | Purushotham Kaushik Muthur Srinath, Mario Pacheco | 2017-04-18 |
| 9508610 | Inline measurement of molding material thickness using terahertz reflectance | Shuhong Liu, Nilanjan Ghosh, Zhiyong Wang, Shripad Gokhale, Jieping Zhang | 2016-11-29 |
| 9389064 | Inline inspection of the contact between conductive traces and substrate for hidden defects using white light interferometer with tilted objective lens | Shuhong Liu, Zhiyong Wang, Nilanjan Ghosh | 2016-07-12 |
| 9291576 | Detection of defect in die | Mario Pacheco | 2016-03-22 |