Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11322456 | Die back side structures for warpage control | Feras Eid, Venkata Suresh R. Guthikonda, Shankar Devasenathipathy, Chandra Mohan Jha, Je-Young Chang +2 more | 2022-05-03 |
| 10845552 | Coreless package architecture for multi-chip opto-electronics | Shawna M. Liff, Henning Braunisch, Timothy A. Gosselin, Yikang Deng, Zhiguo Qian | 2020-11-24 |
| 10231338 | Methods of forming trenches in packages structures and structures formed thereby | Naga Sivakumar Yagnamurthy, Huiyang Fei, Pramod Malatkar, Robert M. Nickerson | 2019-03-12 |
| 9633937 | Electronic assembly that includes stacked electronic devices | Huiyang Fei | 2017-04-25 |