Issued Patents All Time
Showing 25 most recent of 56 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12374626 | Architectures and methods of fabricating 3D stacked packages | Feras Eid, Thomas L. Sounart | 2025-07-29 |
| 11978948 | Die with embedded communication cavity | Digvijay A. Raorane | 2024-05-07 |
| 11488880 | Enclosure for an electronic component | Digvijay A. Raorane | 2022-11-01 |
| 11456721 | RF front end module including hybrid filter and active circuits in a single package | Feras Eid, Telesphor Kamgaing, Georgios Dogiamis, Johanna M. Swan | 2022-09-27 |
| 11387200 | Microelectronic devices with high frequency communication modules having compound semiconductor devices integrated on a package fabric | Georgios Dogiamis, Telesphor Kamgaing, Javier A. Falcon, Yoshihiro Tomita | 2022-07-12 |
| 11367708 | Microelectronic devices designed with efficient partitioning of high frequency communication devices integrated on a package fabric | Georgios Dogiamis, Telesphor Kamgaing | 2022-06-21 |
| 11335651 | Microelectronic devices designed with compound semiconductor devices and integrated on an inter die fabric | Telesphor Kamgaing, Georgios Dogiamis, Javier A. Falcon, Shawna M. Liff, Yoshihiro Tomita | 2022-05-17 |
| 11283427 | Hybrid filters and packages therefor | Telesphor Kamgaing, Feras Eid, Georgios Dogiamis, Johanna M. Swan | 2022-03-22 |
| 11239186 | Die with embedded communication cavity | Digvijay A. Raorane | 2022-02-01 |
| 11206008 | Hybrid filter architecture with integrated passives, acoustic wave resonators and hermetically sealed cavities between two resonator dies | Georgios Dogiamis, Telesphor Kamgaing, Feras Eid, Johanna M. Swan | 2021-12-21 |
| 11195806 | High frequency waveguide structure | Digvijay A. Raorane | 2021-12-07 |
| 11189573 | Semiconductor package with electromagnetic interference shielding using metal layers and vias | Digvijay A. Raorane | 2021-11-30 |
| 11128029 | Die with embedded communication cavity | Digvijay A. Raorane | 2021-09-21 |
| 11037892 | Substrate dielectric waveguides in semiconductor packages | Sasha N. Oster, Johanna M. Swan, Telesphor Kamgaing, Georgios Dogiamis, Adel A. Elsherbini | 2021-06-15 |
| 10903818 | Piezoelectric package-integrated film bulk acoustic resonator devices | Feras Eid, Adel A. Elsherbini, Telesphor Kamgaing, Georgios Dogiamis, Valluri Rao +1 more | 2021-01-26 |
| 10897238 | Piezoelectric package-integrated contour mode filter devices | Feras Eid, Georgios Dogiamis, Valluri Rao, Adel A. Elsherbini, Johanna M. Swan +1 more | 2021-01-19 |
| 10887439 | Microelectronic devices designed with integrated antennas on a substrate | Telesphor Kamgaing, Georgios Dogiamis | 2021-01-05 |
| 10867961 | Single layer low cost wafer level packaging for SFF SiP | Chuan Hu | 2020-12-15 |
| 10629551 | Microelectronic devices with high frequency communication modules having compound semiconductor devices integrated on a package fabric | Georgios Dogiamis, Telesphor Kamgaing, Javier A. Falcon, Yoshihiro Tomita | 2020-04-21 |
| 10594294 | Piezoelectric package-integrated delay lines | Adel A. Elsherbini, Feras Eid, Baris Bicen, Telesphor Kamgaing, Georgios Dogiamis +2 more | 2020-03-17 |
| 10573608 | Microelectronic devices designed with high frequency communication devices including compound semiconductor devices integrated on a die fabric on package | Georgios Dogiamis, Telesphor Kamgaing, Eric J. Li, Javier A. Falcon, Yoshihiro Tomita +1 more | 2020-02-25 |
| 10546835 | Microelectronic devices designed with efficient partitioning of high frequency communication devices integrated on a package fabric | Georgios Dogiamis, Telesphor Kamgaing | 2020-01-28 |
| 10535634 | Multi-layer package | Chuan Hu, Thorsten Meyer | 2020-01-14 |
| 10483250 | Three-dimensional small form factor system in package architecture | Adel A. Elsherbini, Lakshman Krishnamurthy, Johanna M. Swan, Alexander Essaian, Torrey W. Frank | 2019-11-19 |
| 10475750 | Systems, methods, and apparatuses for implementing an organic stiffener with an EMI shield for RF integration | Pramod Malatkar | 2019-11-12 |