Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10985080 | Electronic package that includes lamination layer | Pramod Malatkar, Kyle Yazzie, Naga Sivakumar Yagnamurthy, Dilan Seneviratne, Praneeth Akkinepally +3 more | 2021-04-20 |
| 10002814 | Apparatuses and methods to enhance passivation and ILD reliability | Sudarashan V. Rangaraj, Robert L. Sankman | 2018-06-19 |
| 9793225 | Thermal expansion compensators for controlling microelectronic package warpage | Pramod Malatkar | 2017-10-17 |
| 9414484 | Thermal expansion compensators for controlling microelectronic package warpage | Pramod Malatkar | 2016-08-09 |
| 9136239 | Interconnection designs and materials having improved strength and fatigue life | Terry Sterrett | 2015-09-15 |
| 8941236 | Using collapse limiter structures between elements to reduce solder bump bridging | Ameya Limaye, Sandeep B. Sane | 2015-01-27 |
| 8664771 | Apparatuses and methods to enhance passivation and ILD reliability | Sudarashan V. Rangaraj, Bob Sankman | 2014-03-04 |
| 8642462 | Interconnection designs and materials having improved strength and fatigue life | Terry Sterrett | 2014-02-04 |
| 8198185 | Apparatuses and methods to enhance passivation and ILD reliability | Sudarashan V. Rangaraj, Bob Sankman | 2012-06-12 |
| 7719109 | Embedded capacitors for reducing package cracking | Mitul Modi, Sudarshan Rangaraj, Shankar Ganapathysubramanian, Sankara J. Subramanian | 2010-05-18 |
| 7692307 | Compliant structure for an electronic device, method of manufacturing same, and system containing same | Sudarshan Rangaraj, Shankar Ganapathysubramanian, Mitul Modi, Sankara J. Subramanian | 2010-04-06 |
| 7514300 | Mold compound cap in a flip chip multi-matrix array package and process of making same | Vassoudevane Lebonheur | 2009-04-07 |
| 7387827 | Interconnection designs and materials having improved strength and fatigue life | Terry Sterrett | 2008-06-17 |
| 7294533 | Mold compound cap in a flip chip multi-matrix array package and process of making same | Vassou Lebonheur | 2007-11-13 |