Richard J. Harries — 14 Patents at Intel

Richard J. Harries has been granted 14 US patents while listed as an inventor at Intel. The first was granted in 2007 and the most recent in April 2021. Richard J. Harries ranks #332,869 of 4,157,543 US inventors in our database (top 8.0%). Patent records list Richard J. Harries in Chandler, AZ, US.

Patents per Year

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Showing 1–14 of 14 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
10985080	Electronic package that includes lamination layer	Pramod Malatkar, Kyle Yazzie, Naga Sivakumar Yagnamurthy, Dilan Seneviratne, Praneeth Akkinepally +3 more	2021-04-20	$53,056,000
10002814	Apparatuses and methods to enhance passivation and ILD reliability	Sudarashan V. Rangaraj, Robert L. Sankman	2018-06-19	$34,162,000
9793225	Thermal expansion compensators for controlling microelectronic package warpage	Pramod Malatkar	2017-10-17	$9,876,000
9414484	Thermal expansion compensators for controlling microelectronic package warpage	Pramod Malatkar	2016-08-09	$12,367,000
9136239	Interconnection designs and materials having improved strength and fatigue life	Terry Sterrett	2015-09-15	$8,329,000
8941236	Using collapse limiter structures between elements to reduce solder bump bridging	Ameya Limaye, Sandeep B. Sane	2015-01-27	$21,987,000
8664771	Apparatuses and methods to enhance passivation and ILD reliability	Sudarashan V. Rangaraj, Bob Sankman	2014-03-04	$18,335,000
8642462	Interconnection designs and materials having improved strength and fatigue life	Terry Sterrett	2014-02-04	$7,661,000
8198185	Apparatuses and methods to enhance passivation and ILD reliability	Sudarashan V. Rangaraj, Bob Sankman	2012-06-12	$26,197,000
7719109	Embedded capacitors for reducing package cracking	Mitul Modi, Sudarshan Rangaraj, Shankar Ganapathysubramanian, Sankara J. Subramanian	2010-05-18	$11,091,000
7692307	Compliant structure for an electronic device, method of manufacturing same, and system containing same	Sudarshan Rangaraj, Shankar Ganapathysubramanian, Mitul Modi, Sankara J. Subramanian	2010-04-06	$11,081,000
7514300	Mold compound cap in a flip chip multi-matrix array package and process of making same	Vassoudevane Lebonheur	2009-04-07	$17,723,000
7387827	Interconnection designs and materials having improved strength and fatigue life	Terry Sterrett	2008-06-17	$40,097,000
7294533	Mold compound cap in a flip chip multi-matrix array package and process of making same	Vassou Lebonheur	2007-11-13	$26,433,000

Richard J. Harries — 14 Patents

Patents per Year

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