Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7294533 | Mold compound cap in a flip chip multi-matrix array package and process of making same | Richard J. Harries | 2007-11-13 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7294533 | Mold compound cap in a flip chip multi-matrix array package and process of making same | Richard J. Harries | 2007-11-13 |