Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7514300 | Mold compound cap in a flip chip multi-matrix array package and process of making same | Richard J. Harries | 2009-04-07 |
| 7147735 | Vibratable die attachment tool | Terrence Caskey | 2006-12-12 |
| 6975025 | Semiconductor chip package and method of manufacturing same | Debendra Mallik, Eduardo Bolanos | 2005-12-13 |
| 6908789 | Method of making a microelectronic assembly | Gregory J. Lemke | 2005-06-21 |
| 6794225 | Surface treatment for microelectronic device substrate | Rahul N. Manepalli, Terry Sterrett, Tian-An Chen | 2004-09-21 |
| 6617683 | Thermal performance in flip chip/integral heat spreader packages using low modulus thermal interface material | Robert Starkston | 2003-09-09 |