Issued Patents All Time
Showing 25 most recent of 43 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12048545 | Apparatus and method for connecting elements in medical devices | David Chmielewski, Kevin C. Flinn, Andy H. Do, Allyn Jensrud | 2024-07-30 |
| 11707229 | Integrated sensors for medical devices and method of making integrated sensors for medical devices | Allyn Jensrud | 2023-07-25 |
| 11642064 | High density electrode mapping catheter | John J. Crow, Eric Lim, Gregory K. Olson, Jeffrey A. Schweitzer | 2023-05-09 |
| 11154350 | Ablation catheter having electronic device disposed within a lumen | Ron Phan Nguyen, Kevin Justin Herrera | 2021-10-26 |
| 11116449 | Catheter shaft with electrically-conductive traces | Allyn Jensrud | 2021-09-14 |
| 11039773 | High density electrode mapping catheter | John J. Crow, Eric Lim, Gregory K. Olson, Jeffrey A. Schweitzer | 2021-06-22 |
| 10966660 | Integrated sensors for medical devices and method of making integrated sensors for medical devices | Allyn Jensrud | 2021-04-06 |
| 10898096 | Apparatus and method for connecting elements in medical devices | David Chmielewski, Kevin C. Flinn, Andy H. Do, Allyn Jensrud | 2021-01-26 |
| 10716622 | Medical devices including high strength bond joints and methods of making same | Pianka Roy, Allyn Jensrud | 2020-07-21 |
| 10602983 | Integrated sensors for medical devices and method of making integrated sensors for medical devices | Allyn Jensrud | 2020-03-31 |
| 10595738 | High density electrode mapping catheter | John J. Crow, Eric Lim, Gregory K. Olson, Jeffrey A. Schweitzer | 2020-03-24 |
| 10548671 | Medical device with a packaged electronic subassembly and method for fabricating the same | Patrick P. Senarith | 2020-02-04 |
| 10182863 | Medical devices including high strength bond joints and methods of making same | Pianka Roy, Allyn Jensrud | 2019-01-22 |
| 10039912 | System and method for coupling a tube with a medical device handle | Patrick P. Senarith, James V. Kauphusman, Asim Syed, Kirk Kochin Wu | 2018-08-07 |
| 9136239 | Interconnection designs and materials having improved strength and fatigue life | Richard J. Harries | 2015-09-15 |
| 8642462 | Interconnection designs and materials having improved strength and fatigue life | Richard J. Harries | 2014-02-04 |
| 7718216 | Low temperature bumping process | Tian-An Chen, Saikumar Jayaraman | 2010-05-18 |
| 7592704 | Etched interposer for integrated circuit devices | Devendra Natekar | 2009-09-22 |
| 7530164 | Wafer-level underfill process making use of sacrificial contact pad protective material | Paul A. Koning | 2009-05-12 |
| 7521115 | Low temperature bumping process | Tian-An Chen, Saikumar Jayaraman | 2009-04-21 |
| 7413995 | Etched interposer for integrated circuit devices | Devendra Natekar | 2008-08-19 |
| 7387827 | Interconnection designs and materials having improved strength and fatigue life | Richard J. Harries | 2008-06-17 |
| 7345361 | Stackable integrated circuit packaging | Debendra Mallik, Kinya Ichikawa, Johanna M. Swan | 2008-03-18 |
| 7144299 | Methods and devices for supporting substrates using fluids | Leonel Arana, Devendra Natekar | 2006-12-05 |
| 7059048 | Wafer-level underfill process making use of sacrificial contact pad protective material | Paul A. Koning | 2006-06-13 |