| 11410975 |
Display device and method of manufacturing display device |
Katsuyoshi Kadan, Masahiko Sano, Ryohei Hirose, Hiroshi Yoneda |
2022-08-09 |
|
| 11362246 |
Method of manufacturing display device with lateral wiring |
Katsuyoshi Kadan, Masahiko Sano, Ryohei Hirose, Hiroshi Yoneda |
2022-06-14 |
|
| 9741664 |
High density substrate interconnect formed through inkjet printing |
Chia-Pin Chiu, Robert L. Sankman |
2017-08-22 |
$8,061,000 |
| 9685388 |
Picture frame stiffeners for microelectronic packages |
Yoshihiro Tomita, Jiro Kubota, Omkar G. Karhade, Shawna M. Liff, Nitin A. Deshpande |
2017-06-20 |
$9,273,000 |
| 9502368 |
Picture frame stiffeners for microelectronic packages |
Yoshihiro Tomita, Jiro Kubota, Omkar G. Karhade, Shawna M. Liff, Nitin A. Deshpande |
2016-11-22 |
$9,157,000 |
| 9349703 |
Method for making high density substrate interconnect using inkjet printing |
Chia-Pin Chiu, Robert L. Sankman |
2016-05-24 |
$13,693,000 |
| 9263329 |
Methods of connecting a first electronic package to a second electronic package |
Chia-Pin Chiu, Yoshihiro Tomita, Robert L. Sankman, Eric J. Li |
2016-02-16 |
$10,295,000 |
| 8110920 |
In-package microelectronic apparatus, and methods of using same |
Sriram Dattaguru, Lesley A. Polka Wood, Yoshihiro Tomita, Robert L. Sankman |
2012-02-07 |
$29,971,000 |
| 7495330 |
Substrate connector for integrated circuit devices |
— |
2009-02-24 |
$15,365,000 |
| 7345361 |
Stackable integrated circuit packaging |
Debendra Mallik, Terry Sterrett, Johanna M. Swan |
2008-03-18 |
$17,443,000 |
| 7132311 |
Encapsulation of a stack of semiconductor dice |
Masayuki Akiba, Jiro Kubota, Takashi Kumamoto |
2006-11-07 |
$13,207,000 |
| 7132739 |
Encapsulated stack of dice and support therefor |
Masayuki Akiba, Jiro Kubota, Takashi Kumamoto |
2006-11-07 |
$13,207,000 |
| 7097462 |
Patch substrate for external connection |
— |
2006-08-29 |
$13,270,000 |
| 7005729 |
Device packaging using tape automated bonding (TAB) strip bonded to strip carrier frame |
Yukihiro Murakami |
2006-02-28 |
$11,249,000 |
| 6838313 |
Molded flip chip package |
Takashi Kumamoto |
2005-01-04 |
$23,080,000 |
| 6785148 |
Easy mount socket |
Kenzo Ishida, Shuji Inoue, Kenji Takahashi |
2004-08-31 |
$18,815,000 |
| 6632704 |
Molded flip chip package |
Takashi Kumamoto |
2003-10-14 |
$51,971,000 |
| 6342791 |
Diode defect detecting device |
Koichiro Kurata, Suteo Fujino, Chihiro Okado, Takatomo Izume, Yasuo Sakata |
2002-01-29 |
|
| 6020561 |
Printed circuit substrate with solder formed on pad-on-via and pad-off-via contacts thereof |
Kenzo Ishida, Yohko Mashimoto |
2000-02-01 |
$155,838,000 |
| 5811883 |
Design for flip chip joint pad/LGA pad |
Seiichiroh Seki, Takaya Miwa, Yohko Mashimoto |
1998-09-22 |
$64,376,000 |
| 5660321 |
Method for controlling solder bump height and volume for substrates containing both pad-on and pad-off via contacts |
Kenzo Ishida, Yohko Mashimoto |
1997-08-26 |
$383,998,000 |
