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Display device and method of manufacturing display device |
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2022-08-09 |
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Method of manufacturing display device with lateral wiring |
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| 9741664 |
High density substrate interconnect formed through inkjet printing |
Chia-Pin Chiu, Robert L. Sankman |
2017-08-22 |
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Picture frame stiffeners for microelectronic packages |
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Picture frame stiffeners for microelectronic packages |
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2016-11-22 |
| 9349703 |
Method for making high density substrate interconnect using inkjet printing |
Chia-Pin Chiu, Robert L. Sankman |
2016-05-24 |
| 9263329 |
Methods of connecting a first electronic package to a second electronic package |
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2016-02-16 |
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In-package microelectronic apparatus, and methods of using same |
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Substrate connector for integrated circuit devices |
— |
2009-02-24 |
| 7345361 |
Stackable integrated circuit packaging |
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2008-03-18 |
| 7132311 |
Encapsulation of a stack of semiconductor dice |
Masayuki Akiba, Jiro Kubota, Takashi Kumamoto |
2006-11-07 |
| 7132739 |
Encapsulated stack of dice and support therefor |
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2006-11-07 |
| 7097462 |
Patch substrate for external connection |
— |
2006-08-29 |
| 7005729 |
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2006-02-28 |
| 6838313 |
Molded flip chip package |
Takashi Kumamoto |
2005-01-04 |
| 6785148 |
Easy mount socket |
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2004-08-31 |
| 6632704 |
Molded flip chip package |
Takashi Kumamoto |
2003-10-14 |
| 6342791 |
Diode defect detecting device |
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2002-01-29 |
| 6020561 |
Printed circuit substrate with solder formed on pad-on-via and pad-off-via contacts thereof |
Kenzo Ishida, Yohko Mashimoto |
2000-02-01 |
| 5811883 |
Design for flip chip joint pad/LGA pad |
Seiichiroh Seki, Takaya Miwa, Yohko Mashimoto |
1998-09-22 |
| 5660321 |
Method for controlling solder bump height and volume for substrates containing both pad-on and pad-off via contacts |
Kenzo Ishida, Yohko Mashimoto |
1997-08-26 |
