Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11410975 | Display device and method of manufacturing display device | Katsuyoshi Kadan, Masahiko Sano, Ryohei Hirose, Hiroshi Yoneda | 2022-08-09 |
| 11362246 | Method of manufacturing display device with lateral wiring | Katsuyoshi Kadan, Masahiko Sano, Ryohei Hirose, Hiroshi Yoneda | 2022-06-14 |
| 9741664 | High density substrate interconnect formed through inkjet printing | Chia-Pin Chiu, Robert L. Sankman | 2017-08-22 |
| 9685388 | Picture frame stiffeners for microelectronic packages | Yoshihiro Tomita, Jiro Kubota, Omkar G. Karhade, Shawna M. Liff, Nitin A. Deshpande | 2017-06-20 |
| 9502368 | Picture frame stiffeners for microelectronic packages | Yoshihiro Tomita, Jiro Kubota, Omkar G. Karhade, Shawna M. Liff, Nitin A. Deshpande | 2016-11-22 |
| 9349703 | Method for making high density substrate interconnect using inkjet printing | Chia-Pin Chiu, Robert L. Sankman | 2016-05-24 |
| 9263329 | Methods of connecting a first electronic package to a second electronic package | Chia-Pin Chiu, Yoshihiro Tomita, Robert L. Sankman, Eric J. Li | 2016-02-16 |
| 8110920 | In-package microelectronic apparatus, and methods of using same | Sriram Dattaguru, Lesley A. Polka Wood, Yoshihiro Tomita, Robert L. Sankman | 2012-02-07 |
| 7495330 | Substrate connector for integrated circuit devices | — | 2009-02-24 |
| 7345361 | Stackable integrated circuit packaging | Debendra Mallik, Terry Sterrett, Johanna M. Swan | 2008-03-18 |
| 7132311 | Encapsulation of a stack of semiconductor dice | Masayuki Akiba, Jiro Kubota, Takashi Kumamoto | 2006-11-07 |
| 7132739 | Encapsulated stack of dice and support therefor | Masayuki Akiba, Jiro Kubota, Takashi Kumamoto | 2006-11-07 |
| 7097462 | Patch substrate for external connection | — | 2006-08-29 |
| 7005729 | Device packaging using tape automated bonding (TAB) strip bonded to strip carrier frame | Yukihiro Murakami | 2006-02-28 |
| 6838313 | Molded flip chip package | Takashi Kumamoto | 2005-01-04 |
| 6785148 | Easy mount socket | Kenzo Ishida, Shuji Inoue, Kenji Takahashi | 2004-08-31 |
| 6632704 | Molded flip chip package | Takashi Kumamoto | 2003-10-14 |
| 6342791 | Diode defect detecting device | Koichiro Kurata, Suteo Fujino, Chihiro Okado, Takatomo Izume, Yasuo Sakata | 2002-01-29 |
| 6020561 | Printed circuit substrate with solder formed on pad-on-via and pad-off-via contacts thereof | Kenzo Ishida, Yohko Mashimoto | 2000-02-01 |
| 5811883 | Design for flip chip joint pad/LGA pad | Seiichiroh Seki, Takaya Miwa, Yohko Mashimoto | 1998-09-22 |
| 5660321 | Method for controlling solder bump height and volume for substrates containing both pad-on and pad-off via contacts | Kenzo Ishida, Yohko Mashimoto | 1997-08-26 |