| 7724990 |
Fiber array unit with integrated optical power monitor |
— |
2010-05-25 |
| 7330620 |
Low loss funnel-type PLC optical splitter with input cladding mode absorption structure and/or output segmented taper structure |
Alan Tafapolsky, Takaharu Fujiyama |
2008-02-12 |
| 7171743 |
Apparatus and method for warpage compensation of a display panel substrate assembly |
— |
2007-02-06 |
| 6798137 |
Apparatus and method for warpage compensation of a display panel substrate assembly |
— |
2004-09-28 |
| 6785148 |
Easy mount socket |
Shuji Inoue, Kinya Ichikawa, Kenji Takahashi |
2004-08-31 |
| 6697553 |
Compact, low insertion loss, high yield arrayed waveguide grating |
Jyoti Kiron Bhardwaj, Robert J. Brainard, David J. Chapman, Douglas E. Crafts, Zi-Wen Dong +13 more |
2004-02-24 |
| 6664511 |
Package for optical components |
Douglas E. Crafts, James F. Farrell, Mark Farrelly, Suresh Ramalingam |
2003-12-16 |
| 6665475 |
Precision fiber optic alignment and attachment apparatus |
— |
2003-12-16 |
| 6606425 |
Transfer molded packages with embedded thermal insulation |
Douglas E. Crafts, David J. Chapman, Duane Cook, James F. Farrell, Suresh Ramalingam +1 more |
2003-08-12 |
| 6422303 |
Silent heat exchanger and fan assembly |
Shinya Endo, Daryl J. Nelson |
2002-07-23 |
| 6278185 |
Semi-additive process (SAP) architecture for organic leadless grid array packages |
Venkatesan Murali, Brian Kaiser, Anant Vaidyanathan |
2001-08-21 |
| 6173576 |
Cooling unit for an integrated circuit package |
Shuji Inoue |
2001-01-16 |
| 6020561 |
Printed circuit substrate with solder formed on pad-on-via and pad-off-via contacts thereof |
Yohko Mashimoto, Kinya Ichikawa |
2000-02-01 |
| 5660321 |
Method for controlling solder bump height and volume for substrates containing both pad-on and pad-off via contacts |
Yohko Mashimoto, Kinya Ichikawa |
1997-08-26 |