Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7724990 | Fiber array unit with integrated optical power monitor | — | 2010-05-25 |
| 7330620 | Low loss funnel-type PLC optical splitter with input cladding mode absorption structure and/or output segmented taper structure | Alan Tafapolsky, Takaharu Fujiyama | 2008-02-12 |
| 7171743 | Apparatus and method for warpage compensation of a display panel substrate assembly | — | 2007-02-06 |
| 6798137 | Apparatus and method for warpage compensation of a display panel substrate assembly | — | 2004-09-28 |
| 6785148 | Easy mount socket | Shuji Inoue, Kinya Ichikawa, Kenji Takahashi | 2004-08-31 |
| 6697553 | Compact, low insertion loss, high yield arrayed waveguide grating | Jyoti Kiron Bhardwaj, Robert J. Brainard, David J. Chapman, Douglas E. Crafts, Zi-Wen Dong +13 more | 2004-02-24 |
| 6664511 | Package for optical components | Douglas E. Crafts, James F. Farrell, Mark Farrelly, Suresh Ramalingam | 2003-12-16 |
| 6665475 | Precision fiber optic alignment and attachment apparatus | — | 2003-12-16 |
| 6606425 | Transfer molded packages with embedded thermal insulation | Douglas E. Crafts, David J. Chapman, Duane Cook, James F. Farrell, Suresh Ramalingam +1 more | 2003-08-12 |
| 6422303 | Silent heat exchanger and fan assembly | Shinya Endo, Daryl J. Nelson | 2002-07-23 |
| 6278185 | Semi-additive process (SAP) architecture for organic leadless grid array packages | Venkatesan Murali, Brian Kaiser, Anant Vaidyanathan | 2001-08-21 |
| 6173576 | Cooling unit for an integrated circuit package | Shuji Inoue | 2001-01-16 |
| 6020561 | Printed circuit substrate with solder formed on pad-on-via and pad-off-via contacts thereof | Yohko Mashimoto, Kinya Ichikawa | 2000-02-01 |
| 5660321 | Method for controlling solder bump height and volume for substrates containing both pad-on and pad-off via contacts | Yohko Mashimoto, Kinya Ichikawa | 1997-08-26 |