Kenzo Ishida — 14 Patents at Intel

Kenzo Ishida has been granted 14 US patents while listed as an inventor at Intel. The first was granted in 1997 and the most recent in May 2010. Kenzo Ishida ranks #332,869 of 4,157,543 US inventors in our database (top 8.0%). Patent records list Kenzo Ishida in Ibaraki, CA, JP.

Issued Patents All Time

Showing 1–14 of 14 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
7724990	Fiber array unit with integrated optical power monitor	—	2010-05-25
7330620	Low loss funnel-type PLC optical splitter with input cladding mode absorption structure and/or output segmented taper structure	Alan Tafapolsky, Takaharu Fujiyama	2008-02-12
7171743	Apparatus and method for warpage compensation of a display panel substrate assembly	—	2007-02-06	$13,917,000
6798137	Apparatus and method for warpage compensation of a display panel substrate assembly	—	2004-09-28	$27,830,000
6785148	Easy mount socket	Shuji Inoue, Kinya Ichikawa, Kenji Takahashi	2004-08-31	$18,815,000
6697553	Compact, low insertion loss, high yield arrayed waveguide grating	Jyoti Kiron Bhardwaj, Robert J. Brainard, David J. Chapman, Douglas E. Crafts, Zi-Wen Dong +13 more	2004-02-24	$40,480,000
6664511	Package for optical components	Douglas E. Crafts, James F. Farrell, Mark Farrelly, Suresh Ramalingam	2003-12-16	$28,740,000
6665475	Precision fiber optic alignment and attachment apparatus	—	2003-12-16	$28,740,000
6606425	Transfer molded packages with embedded thermal insulation	Douglas E. Crafts, David J. Chapman, Duane Cook, James F. Farrell, Suresh Ramalingam +1 more	2003-08-12	$18,422,000
6422303	Silent heat exchanger and fan assembly	Shinya Endo, Daryl J. Nelson	2002-07-23	$72,932,000
6278185	Semi-additive process (SAP) architecture for organic leadless grid array packages	Venkatesan Murali, Brian Kaiser, Anant Vaidyanathan	2001-08-21	$236,055,000
6173576	Cooling unit for an integrated circuit package	Shuji Inoue	2001-01-16	$216,902,000
6020561	Printed circuit substrate with solder formed on pad-on-via and pad-off-via contacts thereof	Yohko Mashimoto, Kinya Ichikawa	2000-02-01	$155,838,000
5660321	Method for controlling solder bump height and volume for substrates containing both pad-on and pad-off via contacts	Yohko Mashimoto, Kinya Ichikawa	1997-08-26	$383,998,000

Kenzo Ishida — 14 Patents

Issued Patents All Time

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