Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 10960425 | Mechanism for delivering highly viscous materials for coating an interior surface of a tubular substrate | Kirk Brink | 2021-03-30 | |
| 7348496 | Circuit board with organic dielectric layer | Paul H. Wermer | 2008-03-25 | $11,219,000 |
| 6829133 | Capacitor | Paul H. Wermer | 2004-12-07 | $37,431,000 |
| 6605551 | Electrocoating process to form a dielectric layer in an organic substrate to reduce loop inductance | Paul H. Wermer | 2003-08-12 | $56,289,000 |
| 6278185 | Semi-additive process (SAP) architecture for organic leadless grid array packages | Venkatesan Murali, Kenzo Ishida, Anant Vaidyanathan | 2001-08-21 | $236,055,000 |
| 6248951 | Dielectric decal for a substrate of an integrated circuit package | Venkatesan Murali, Nagesh Vodrahalli | 2001-06-19 | $181,106,000 |
| 5139971 | Anneal to decrease moisture absorbance of intermetal dielectrics | Ragupathy V. Giridhar, Philip E. Freiberger, Yi-Ching Lin | 1992-08-18 | $106,252,000 |