| 7535728 |
Electronic assemblies comprising ceramic/organic hybrid substrate with embedded capacitors |
Kishore K. Chakravorty, David G. Figueroa, Debabrata Gupta |
2009-05-19 |
| 7348496 |
Circuit board with organic dielectric layer |
Brian Kaiser |
2008-03-25 |
| 7159313 |
Solderless electronics packaging and methods of manufacture |
Ajit Sathe |
2007-01-09 |
| 7136275 |
Polymeric dielectric material for high-energy density capacitors |
Paul A. Koning |
2006-11-14 |
| 7120031 |
Data processing system comprising ceramic/organic hybrid substrate with embedded capacitors |
Kishore K. Chakravorty, David G. Figueroa, Debabrata Gupta |
2006-10-10 |
| 7067356 |
Method of fabricating microelectronic package having a bumpless laminated interconnection layer |
Steven Towle |
2006-06-27 |
| 6840777 |
Solderless electronics packaging |
Ajit Sathe |
2005-01-11 |
| 6829133 |
Capacitor |
Brian Kaiser |
2004-12-07 |
| 6775150 |
Electronic assembly comprising ceramic/organic hybrid substrate with embedded capacitors and methods of manufacture |
Kishore K. Chakravorty, David G. Figueroa, Debabrata Gupta |
2004-08-10 |
| 6605551 |
Electrocoating process to form a dielectric layer in an organic substrate to reduce loop inductance |
Brian Kaiser |
2003-08-12 |
| 6555906 |
Microelectronic package having a bumpless laminated interconnection layer |
Steven Towle |
2003-04-29 |
| 6480370 |
Polymeric dielectric material for high-energy density capacitors |
Paul A. Koning |
2002-11-12 |