| 9247686 |
Polymer matrices for polymer solder hybrid materials |
Saikumar Jayaraman, Ashay Dani |
2016-01-26 |
$9,792,000 |
| 8703286 |
Polymer matrices for polymer solder hybrid materials |
Saikumar Jayaraman, Ashay Dani |
2014-04-22 |
$10,911,000 |
| 8193072 |
Semiconductor wafer coat layers and methods therefor |
Eric J. Li, Daoqiang Lu, Christopher L. Rumer, Darcy E. Fleming, Gudbjorg H. Oskarsdottir +1 more |
2012-06-05 |
$18,221,000 |
| 8129223 |
Nanotube modified solder thermal intermediate structure, systems, and methods |
Bryan M. White |
2012-03-06 |
$22,588,000 |
| 7985627 |
Thermal intermediate apparatus, systems, and methods |
Bryan M. White, Yuegang Zhang, C. Garner |
2011-07-26 |
$21,887,000 |
| 7967942 |
Polymer matrices for polymer solder hybrid materials |
Saikumar Jayaraman, Ashay Dani |
2011-06-28 |
$18,630,000 |
| 7960019 |
Phase change material containing fusible particles as thermally conductive filler |
Salkumar Jayaraman, Ashay Dani |
2011-06-14 |
$17,389,000 |
| 7897486 |
Semiconductor wafer coat layers and methods therefor |
Eric J. Li, Daoqiang Lu, Christopher L. Rumer, Darcy E. Fleming, Gudbjorg H. Oskarsdottir +1 more |
2011-03-01 |
$14,929,000 |
| 7846778 |
Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and method of making an electronic assembly |
Christopher L. Rumer, Sabina J. Houle, Saikumar Jayaraman, Ashay Dani |
2010-12-07 |
$26,454,000 |
| 7816171 |
Component packaging apparatus, systems, and methods |
James C. Matayabas, Jr. |
2010-10-19 |
$13,567,000 |
| 7794623 |
Microelectronic device having liquid crystalline epoxy resins |
James C. Matayabas, Jr. |
2010-09-14 |
$15,475,000 |
| 7619318 |
No-flow underfill composition and method |
Christopher L. Rumer, Tian-An Chen, Vijay Wakharkar |
2009-11-17 |
$26,173,000 |
| 7534650 |
Carbon-carbon and/or metal-carbon fiber composite heat spreader |
Sabina J. Houle, Greg M. Chrysler |
2009-05-19 |
$16,372,000 |
| 7530164 |
Wafer-level underfill process making use of sacrificial contact pad protective material |
Terry Sterrett |
2009-05-12 |
$14,965,000 |
| 7473995 |
Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and method of making an electronic assembly |
Christopher L. Rumer, Sabina J. Houle, Saikumar Jayaraman, Ashay Dani |
2009-01-06 |
$21,219,000 |
| 7456052 |
Thermal intermediate apparatus, systems, and methods |
Bryan M. White, Yuegang Zhang, C. Garner |
2008-11-25 |
$14,078,000 |
| 7417111 |
Liquid crystalline epoxy resins |
James C. Matayabas, Jr. |
2008-08-26 |
$24,347,000 |
| 7408787 |
Phase change thermal interface materials including polyester resin |
James C. Matayabas, Jr. |
2008-08-05 |
$25,514,000 |
| 7365414 |
Component packaging apparatus, systems, and methods |
James C. Matayabas, Jr. |
2008-04-29 |
$13,885,000 |
| 7331500 |
Solder bumps formation using solder paste with shape retaining attribute |
Edward L. Martin |
2008-02-19 |
$15,849,000 |
| 7311967 |
Thermal interface material and electronic assembly having such a thermal interface material |
Ashay Dani, Saikumar Jayaraman, Christopher L. Rumer |
2007-12-25 |
|
| 7294394 |
Phase change material containing fusible particles as thermally conductive filler |
Saikumar Jayaraman, Ashay Dani |
2007-11-13 |
$26,433,000 |
| 7279362 |
Semiconductor wafer coat layers and methods therefor |
Eric J. Li, Daoqiang Lu, Christopher L. Rumer, Darcy E. Fleming, Gudbjorg H. Oskarsdottir +1 more |
2007-10-09 |
$11,205,000 |
| 7252877 |
Polymer matrices for polymer solder hybrid materials |
Saikumar Jayaraman, Ashay Dani |
2007-08-07 |
$27,562,000 |
| 7229933 |
Embossing processes for substrate imprinting, structures made thereby, and polymers used therefor |
— |
2007-06-12 |
$15,149,000 |
