Issued Patents All Time
Showing 25 most recent of 52 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9247686 | Polymer matrices for polymer solder hybrid materials | Saikumar Jayaraman, Ashay Dani | 2016-01-26 |
| 8703286 | Polymer matrices for polymer solder hybrid materials | Saikumar Jayaraman, Ashay Dani | 2014-04-22 |
| 8193072 | Semiconductor wafer coat layers and methods therefor | Eric J. Li, Daoqiang Lu, Christopher L. Rumer, Darcy E. Fleming, Gudbjorg H. Oskarsdottir +1 more | 2012-06-05 |
| 8129223 | Nanotube modified solder thermal intermediate structure, systems, and methods | Bryan M. White | 2012-03-06 |
| 7985627 | Thermal intermediate apparatus, systems, and methods | Bryan M. White, Yuegang Zhang, C. Garner | 2011-07-26 |
| 7967942 | Polymer matrices for polymer solder hybrid materials | Saikumar Jayaraman, Ashay Dani | 2011-06-28 |
| 7960019 | Phase change material containing fusible particles as thermally conductive filler | Salkumar Jayaraman, Ashay Dani | 2011-06-14 |
| 7897486 | Semiconductor wafer coat layers and methods therefor | Eric J. Li, Daoqiang Lu, Christopher L. Rumer, Darcy E. Fleming, Gudbjorg H. Oskarsdottir +1 more | 2011-03-01 |
| 7846778 | Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and method of making an electronic assembly | Christopher L. Rumer, Sabina J. Houle, Saikumar Jayaraman, Ashay Dani | 2010-12-07 |
| 7816171 | Component packaging apparatus, systems, and methods | James C. Matayabas, Jr. | 2010-10-19 |
| 7794623 | Microelectronic device having liquid crystalline epoxy resins | James C. Matayabas, Jr. | 2010-09-14 |
| 7619318 | No-flow underfill composition and method | Christopher L. Rumer, Tian-An Chen, Vijay Wakharkar | 2009-11-17 |
| 7534650 | Carbon-carbon and/or metal-carbon fiber composite heat spreader | Sabina J. Houle, Greg M. Chrysler | 2009-05-19 |
| 7530164 | Wafer-level underfill process making use of sacrificial contact pad protective material | Terry Sterrett | 2009-05-12 |
| 7473995 | Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and method of making an electronic assembly | Christopher L. Rumer, Sabina J. Houle, Saikumar Jayaraman, Ashay Dani | 2009-01-06 |
| 7456052 | Thermal intermediate apparatus, systems, and methods | Bryan M. White, Yuegang Zhang, C. Garner | 2008-11-25 |
| 7417111 | Liquid crystalline epoxy resins | James C. Matayabas, Jr. | 2008-08-26 |
| 7408787 | Phase change thermal interface materials including polyester resin | James C. Matayabas, Jr. | 2008-08-05 |
| 7365414 | Component packaging apparatus, systems, and methods | James C. Matayabas, Jr. | 2008-04-29 |
| 7331500 | Solder bumps formation using solder paste with shape retaining attribute | Edward L. Martin | 2008-02-19 |
| 7311967 | Thermal interface material and electronic assembly having such a thermal interface material | Ashay Dani, Saikumar Jayaraman, Christopher L. Rumer | 2007-12-25 |
| 7294394 | Phase change material containing fusible particles as thermally conductive filler | Saikumar Jayaraman, Ashay Dani | 2007-11-13 |
| 7279362 | Semiconductor wafer coat layers and methods therefor | Eric J. Li, Daoqiang Lu, Christopher L. Rumer, Darcy E. Fleming, Gudbjorg H. Oskarsdottir +1 more | 2007-10-09 |
| 7252877 | Polymer matrices for polymer solder hybrid materials | Saikumar Jayaraman, Ashay Dani | 2007-08-07 |
| 7229933 | Embossing processes for substrate imprinting, structures made thereby, and polymers used therefor | — | 2007-06-12 |