Issued Patents All Time
Showing 25 most recent of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12002727 | Barrier structures for underfill containment | Ziyin Lin, Vipul V. Mehta, Wei Li, Edvin Cetegen, Xavier Francois Brun +6 more | 2024-06-04 |
| 11222877 | Thermally coupled package-on-package semiconductor packages | Omkar G. Karhade, Robert L. Sankman, Nitin A. Deshpande, Mitul Modi, Thomas J. De Bonis +6 more | 2022-01-11 |
| 11056466 | Package on package thermal transfer systems and methods | Omkar G. Karhade, Nitin A. Deshpande, Robert M. Nickerson | 2021-07-06 |
| 10438930 | Package on package thermal transfer systems and methods | Omkar G. Karhade, Nitin A. Deshpande, Robert M. Nickerson | 2019-10-08 |
| 8193072 | Semiconductor wafer coat layers and methods therefor | Eric J. Li, Daoqiang Lu, Paul A. Koning, Darcy E. Fleming, Gudbjorg H. Oskarsdottir +1 more | 2012-06-05 |
| 7996989 | Heat dissipating device with preselected designed interface for thermal interface materials | Ashay Dani, Sabina J. Houle, Thomas J. Fitzgerald | 2011-08-16 |
| 7897486 | Semiconductor wafer coat layers and methods therefor | Eric J. Li, Daoqiang Lu, Paul A. Koning, Darcy E. Fleming, Gudbjorg H. Oskarsdottir +1 more | 2011-03-01 |
| 7846778 | Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and method of making an electronic assembly | Sabina J. Houle, Saikumar Jayaraman, Paul A. Koning, Ashay Dani | 2010-12-07 |
| 7619318 | No-flow underfill composition and method | Tian-An Chen, Vijay Wakharkar, Paul A. Koning | 2009-11-17 |
| 7611966 | Dual pulsed beam laser micromachining method | Eric J. Li, Sergei Voronov | 2009-11-03 |
| 7527090 | Heat dissipating device with preselected designed interface for thermal interface materials | Ashay Dani, Sabina J. Houle, Thomas J. Fitzgerald | 2009-05-05 |
| 7473995 | Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and method of making an electronic assembly | Sabina J. Houle, Saikumar Jayaraman, Paul A. Koning, Ashay Dani | 2009-01-06 |
| 7358606 | Apparatus to compensate for stress between heat spreader and thermal interface material | Sabina J. Houle | 2008-04-15 |
| 7311967 | Thermal interface material and electronic assembly having such a thermal interface material | Ashay Dani, Paul A. Koning, Saikumar Jayaraman | 2007-12-25 |
| 7303977 | Laser micromachining method | Sergei Voronov | 2007-12-04 |
| 7304381 | Package and method for attaching an integrated heat spreader | Sabina J. Houle, Oswald Skeete, Mike Reiter, Jeff Wienrich | 2007-12-04 |
| 7279362 | Semiconductor wafer coat layers and methods therefor | Eric J. Li, Daoqiang Lu, Paul A. Koning, Darcy E. Fleming, Gudbjorg H. Oskarsdottir +1 more | 2007-10-09 |
| 7247517 | Method and apparatus for a dual substrate package | Kuljeet Singh | 2007-07-24 |
| 7169687 | Laser micromachining method | Eric J. Li, Sergei Voronov | 2007-01-30 |
| 7059045 | Method for handling integrated circuit die | Daoqiang Lu | 2006-06-13 |
| 6992891 | Metal ball attachment of heat dissipation devices | Debendra Mallik, Jeffrey Winton, Michele Berry | 2006-01-31 |
| 6982492 | No-flow underfill composition and method | Tian-An Chen, Vijay Wakharkar, Paul A. Koning | 2006-01-03 |
| 6974723 | Gel thermal interface materials comprising fillers having low melting point and electronic packages comprising these gel thermal interface materials | James C. Matayabas, Jr., Paul A. Koning, Ashay Dani | 2005-12-13 |
| 6924551 | Through silicon via, folded flex microelectronic package | Edward A. Zarbock | 2005-08-02 |
| 6911726 | Microelectronic packaging and methods for thermally protecting package interconnects and components | Saikumar Jayaraman | 2005-06-28 |