| 12002727 |
Barrier structures for underfill containment |
Ziyin Lin, Vipul V. Mehta, Wei Li, Edvin Cetegen, Xavier Francois Brun +6 more |
2024-06-04 |
$24,500,000 |
| 11222877 |
Thermally coupled package-on-package semiconductor packages |
Omkar G. Karhade, Robert L. Sankman, Nitin A. Deshpande, Mitul Modi, Thomas J. De Bonis +6 more |
2022-01-11 |
$33,310,000 |
| 11056466 |
Package on package thermal transfer systems and methods |
Omkar G. Karhade, Nitin A. Deshpande, Robert M. Nickerson |
2021-07-06 |
$31,309,000 |
| 10438930 |
Package on package thermal transfer systems and methods |
Omkar G. Karhade, Nitin A. Deshpande, Robert M. Nickerson |
2019-10-08 |
$19,521,000 |
| 8193072 |
Semiconductor wafer coat layers and methods therefor |
Eric J. Li, Daoqiang Lu, Paul A. Koning, Darcy E. Fleming, Gudbjorg H. Oskarsdottir +1 more |
2012-06-05 |
$18,221,000 |
| 7996989 |
Heat dissipating device with preselected designed interface for thermal interface materials |
Ashay Dani, Sabina J. Houle, Thomas J. Fitzgerald |
2011-08-16 |
$18,060,000 |
| 7897486 |
Semiconductor wafer coat layers and methods therefor |
Eric J. Li, Daoqiang Lu, Paul A. Koning, Darcy E. Fleming, Gudbjorg H. Oskarsdottir +1 more |
2011-03-01 |
$14,929,000 |
| 7846778 |
Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and method of making an electronic assembly |
Sabina J. Houle, Saikumar Jayaraman, Paul A. Koning, Ashay Dani |
2010-12-07 |
$26,454,000 |
| 7619318 |
No-flow underfill composition and method |
Tian-An Chen, Vijay Wakharkar, Paul A. Koning |
2009-11-17 |
$26,173,000 |
| 7611966 |
Dual pulsed beam laser micromachining method |
Eric J. Li, Sergei Voronov |
2009-11-03 |
$21,230,000 |
| 7527090 |
Heat dissipating device with preselected designed interface for thermal interface materials |
Ashay Dani, Sabina J. Houle, Thomas J. Fitzgerald |
2009-05-05 |
$25,050,000 |
| 7473995 |
Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and method of making an electronic assembly |
Sabina J. Houle, Saikumar Jayaraman, Paul A. Koning, Ashay Dani |
2009-01-06 |
$21,219,000 |
| 7358606 |
Apparatus to compensate for stress between heat spreader and thermal interface material |
Sabina J. Houle |
2008-04-15 |
$20,104,000 |
| 7311967 |
Thermal interface material and electronic assembly having such a thermal interface material |
Ashay Dani, Paul A. Koning, Saikumar Jayaraman |
2007-12-25 |
|
| 7303977 |
Laser micromachining method |
Sergei Voronov |
2007-12-04 |
$21,616,000 |
| 7304381 |
Package and method for attaching an integrated heat spreader |
Sabina J. Houle, Oswald Skeete, Mike Reiter, Jeff Wienrich |
2007-12-04 |
$21,616,000 |
| 7279362 |
Semiconductor wafer coat layers and methods therefor |
Eric J. Li, Daoqiang Lu, Paul A. Koning, Darcy E. Fleming, Gudbjorg H. Oskarsdottir +1 more |
2007-10-09 |
$11,205,000 |
| 7247517 |
Method and apparatus for a dual substrate package |
Kuljeet Singh |
2007-07-24 |
$22,724,000 |
| 7169687 |
Laser micromachining method |
Eric J. Li, Sergei Voronov |
2007-01-30 |
$14,098,000 |
| 7059045 |
Method for handling integrated circuit die |
Daoqiang Lu |
2006-06-13 |
$12,187,000 |
| 6992891 |
Metal ball attachment of heat dissipation devices |
Debendra Mallik, Jeffrey Winton, Michele Berry |
2006-01-31 |
$19,938,000 |
| 6982492 |
No-flow underfill composition and method |
Tian-An Chen, Vijay Wakharkar, Paul A. Koning |
2006-01-03 |
$22,757,000 |
| 6974723 |
Gel thermal interface materials comprising fillers having low melting point and electronic packages comprising these gel thermal interface materials |
James C. Matayabas, Jr., Paul A. Koning, Ashay Dani |
2005-12-13 |
$11,810,000 |
| 6924551 |
Through silicon via, folded flex microelectronic package |
Edward A. Zarbock |
2005-08-02 |
$20,766,000 |
| 6911726 |
Microelectronic packaging and methods for thermally protecting package interconnects and components |
Saikumar Jayaraman |
2005-06-28 |
$36,074,000 |
