Issued Patents All Time
Showing 26–29 of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6892927 | Method and apparatus for bonding a wire to a bond pad on a device | Gregory S. Clemons | 2005-05-17 |
| 6867124 | Integrated circuit packaging design and method | Gregory S. Clemons | 2005-03-15 |
| 6841867 | Gel thermal interface materials comprising fillers having low melting point and electronic packages comprising these gel thermal interface materials | James C. Matayabas, Jr., Paul A. Koning, Ashay Dani | 2005-01-11 |
| 6748350 | Method to compensate for stress between heat spreader and thermal interface material | Sabina J. Houle | 2004-06-08 |