Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10794840 | Apparatus for semiconductor package inspection | Liang Zhang, Jianyong Mo, Darren Vance, Di Xu, Robert F. Wiedmaier | 2020-10-06 |
| 10468367 | Solder in cavity interconnection structures | Chuan Hu, Shawna M. Liff | 2019-11-05 |
| 9530747 | Solder in cavity interconnection structures | Chuan Hu, Shawna M. Liff | 2016-12-27 |
| 9006890 | Solder in cavity interconnection structures | Chuan Hu, Shawna M. Liff | 2015-04-14 |
| 8936967 | Solder in cavity interconnection structures | Chuan Hu, Shawna M. Liff | 2015-01-20 |
| 7584536 | Process for precise alignment of packaging caps on a substrate | Mitesh Patel | 2009-09-08 |
| 7297369 | Process for micro-grooving a polymer alignment layer for a liquid crystal display | — | 2007-11-20 |
| 7275312 | Apparatus for precise alignment of packaging caps on a substrate | Mitesh Patel | 2007-10-02 |
| 6892927 | Method and apparatus for bonding a wire to a bond pad on a device | Christopher L. Rumer | 2005-05-17 |
| 6867124 | Integrated circuit packaging design and method | Christopher L. Rumer | 2005-03-15 |