| 12483781 |
Power manager to support less-than-nominal conditions in a machine vision system |
Christopher P. Klicpera, Nina Feinstein, Matthew Lawrence Horner, John B. Evans |
2025-11-25 |
|
| 12160925 |
Enhanced device discovery to support multiple clients and high data bandwidth |
Tharindu S. Rathnathunga, Thomas C. Bellizzi, Jr., Pragnesh Kishorbhai Sanchaniya |
2024-12-03 |
$10,444,000 |
| 10763188 |
Integrated heat spreader having electromagnetically-formed features |
Aravindha R. Antoniswamy, Kumaran Murugesan Chakravarthy, Syadwad Jain, Wei Hu, Zhizhong Tang |
2020-09-01 |
$24,773,000 |
| 10236233 |
Heat spreaders with integrated preforms |
Aravindha R. Antoniswamy |
2019-03-19 |
$29,538,000 |
| 9799584 |
Heat spreaders with integrated preforms |
Aravindha R. Antoniswamy |
2017-10-24 |
$10,797,000 |
| 9515003 |
Embedded air core inductors for integrated circuit package substrates with thermal conductor |
William J. Lambert, Shrenik Kothari, Punita Sullhan, Aravindha R. Antoniswamy |
2016-12-06 |
$8,381,000 |
| 9330999 |
Multi-component integrated heat spreader for multi-chip packages |
Aravindha R. Antoniswamy, Carl Deppisch, Nikunj P. Patel |
2016-05-03 |
$11,131,000 |
| 8490550 |
Roller coaster with articulable seat backs |
David W. Crawford, Derek Howard, David Durham, James H. Shull |
2013-07-23 |
$391,955,000 |
| 8179337 |
Mobile projected sets |
Gregory A. Wilzbach, Janice L. Mulholland, David Durham, David W. Crawford |
2012-05-15 |
$78,447,000 |
| 7996989 |
Heat dissipating device with preselected designed interface for thermal interface materials |
Ashay Dani, Sabina J. Houle, Christopher L. Rumer |
2011-08-16 |
$18,060,000 |
| 7882683 |
Systems and methods of processing and transporting waste |
Ritchie G. Studer, Rick R. Redle, Irfan A. Toor, F. Scott Crawford |
2011-02-08 |
|
| 7672132 |
Electronic packaging apparatus and method |
Carl Deppisch, Manjit Dhindsa, Mark Norwil, Matthew J. Schaenzer |
2010-03-02 |
$14,883,000 |
| 7553702 |
Integrating a heat spreader with an interface material having reduced void size |
Mukul Renavikar, Susheel Jadhav |
2009-06-30 |
$20,585,000 |
| 7527090 |
Heat dissipating device with preselected designed interface for thermal interface materials |
Ashay Dani, Sabina J. Houle, Christopher L. Rumer |
2009-05-05 |
$25,050,000 |
| 7364063 |
Thermally coupling an integrated heat spreader to a heat sink base |
Matthew J. Schaenzer, Tim Renfro, Manjit Dhindsa, Vaibhav P. Trivedi |
2008-04-29 |
$13,885,000 |
| 7362580 |
Electronic assembly having an indium wetting layer on a thermally conductive body |
Fay Hua, Carl Deppisch, Gregory M. Chrysler |
2008-04-22 |
$13,499,000 |
| 7256058 |
Device and method for package warp compensation in an integrated heat spreader |
Carl Deppisch, Fay Hua |
2007-08-14 |
$18,880,000 |
| 7239517 |
Integrated heat spreader and method for using |
Mukul Renavikar, Susheel Jadhav |
2007-07-03 |
$20,127,000 |
| 7219421 |
Method of a coating heat spreader |
Joan K. Vrtis, Joni G. Hansen, Carl Deppisch |
2007-05-22 |
$18,006,000 |
| 7160758 |
Electronic packaging apparatus and method |
Carl Deppisch, Manjit Dhindsa, Mark Norwil, Matthew J. Schaenzer |
2007-01-09 |
$12,865,000 |
| 7102226 |
Device and method for package warp compensation in an integrated heat spreader |
Carl Deppisch, Fay Hua |
2006-09-05 |
$13,820,000 |
| 7081669 |
Device and system for heat spreader with controlled thermal expansion |
Carl Deppisch, Fay Hua |
2006-07-25 |
$17,394,000 |
| 6848172 |
Device and method for package warp compensation in an integrated heat spreader |
Carl Deppisch, Fay Hua |
2005-02-01 |
$25,622,000 |
| 6817091 |
Electronic assembly having solder thermal interface between a die substrate and a heat spreader |
Carl Deppisch, Fay Hua |
2004-11-16 |
$29,403,000 |
| 6751099 |
Coated heat spreaders |
Joan K. Vrtis, Joni G. Hansen, Carl Deppisch |
2004-06-15 |
$34,603,000 |
