Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method and apparatus for a dual substrate package

Method and apparatus for a dual substrate package

US Patent 7247517 · Granted Jul 24, 2007

Estimated economic value: $22,724,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Barrier structures for underfill containment2024
Thermally coupled package-on-package semiconductor packages2022
Package on package thermal transfer systems and methods2021
Package on package thermal transfer systems and methods2019
Semiconductor wafer coat layers and methods therefor2012
Heat dissipating device with preselected designed interface for thermal interfac2011
Semiconductor wafer coat layers and methods therefor2011
Integrated heat spreader, heat sink or heat pipe with pre-attached phase change 2010
No-flow underfill composition and method2009
Dual pulsed beam laser micromachining method2009
Heat dissipating device with preselected designed interface for thermal interfac2009
Integrated heat spreader, heat sink or heat pipe with pre-attached phase change 2009