Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Thermally coupled package-on-package semiconductor packages

Thermally coupled package-on-package semiconductor packages

US Patent 11222877 · Granted Jan 11, 2022

Estimated economic value: $33,310,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Reduced bridge structure for a photonic integrated circuit2025
HBI die architecture with fiducial in street for no metal depopulation in active2025
HBI die architecture with fiducial in street for no metal depopulation in active2025
Package architecture of photonic system with vertically stacked dies having plan2025
Package architecture of photonic system with vertically stacked dies having plan2025
Package architecture of scalable compute wall having compute bricks with vertica2025
Package architecture of scalable compute wall having compute bricks with vertica2025
Formation of a reconstituted circuit device using flow of a material by capillar2025
Formation of a reconstituted circuit device using flow of a material by capillar2025
Faraday rotator interconnect as a through-via configuration in a patch architect2025
Faraday rotator interconnect as a through-via configuration in a patch architect2025
Ultra-thin, hyper-density semiconductor packages2025