Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11222877 | Thermally coupled package-on-package semiconductor packages | Omkar G. Karhade, Robert L. Sankman, Nitin A. Deshpande, Mitul Modi, Thomas J. De Bonis +6 more | 2022-01-11 |