Patents per Year
Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 12381029 | Stepped coax MIL PTHS for modulating inductance within a package | Brandon C. Marin, Krishna Bharath, Tarek A. Ibrahim | 2025-08-05 | |
| 12336197 | In-plane inductors in IC packages | Brandon C. Marin, Tarek A. Ibrahim, Prithwish Chatterjee, Yikang Deng, Sheng Li +1 more | 2025-06-17 | |
| 12224252 | Magnetic core inductors in interposer | Krishna Bharath, William J. Lambert, Siddharth Kulasekaran, Mathew J. Manusharow, Anne Augustine | 2025-02-11 | |
| 11552019 | Substrate patch reconstitution options | Amruthavalli Pallavi Alur, Wei-Lun Kane Jen, Islam A. Salama | 2023-01-10 | $14,061,000 |
| 11222877 | Thermally coupled package-on-package semiconductor packages | Omkar G. Karhade, Robert L. Sankman, Nitin A. Deshpande, Mitul Modi, Thomas J. De Bonis +6 more | 2022-01-11 | $33,310,000 |