Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 12334242 | Coreless electronic substrates having embedded inductors | Sanka Ganesan, Sri Chaitra Jyotsna Chavali, Robert L. Sankman, Kaladhar Radhakrishnan | 2025-06-17 | |
| 12224252 | Magnetic core inductors in interposer | Krishna Bharath, William J. Lambert, Haifa Hariri, Siddharth Kulasekaran, Mathew J. Manusharow | 2025-02-11 | |
| 11690165 | Package substrate inductor having thermal interconnect structures | Michael J. Hill, Huong Do | 2023-06-27 | $18,721,000 |
| 11357096 | Package substrate inductor having thermal interconnect structures | Michael J. Hill, Huong Do | 2022-06-07 | $12,864,000 |
| 11335620 | Package inductor having thermal solution structures | Michael J. Hill, Huong Do, William J. Lambert | 2022-05-17 | $14,251,000 |