| 12074514 |
Two stage multi-input multi-output regulator |
Kaladhar Radhakrishnan, Beomseok Choi |
2024-08-27 |
$26,513,000 |
| 11804426 |
Integrated circuit structures in package substrates |
Sanka Ganesan, William J. Lambert, Zhichao Zhang, Sri Chaitra Jyotsna Chavali, Stephen Andrew Smith +1 more |
2023-10-31 |
$30,374,000 |
| 11690165 |
Package substrate inductor having thermal interconnect structures |
Huong Do, Anne Augustine |
2023-06-27 |
$18,721,000 |
| 11527489 |
Apparatus and system with package stiffening magnetic inductor core and methods of making the same |
Mathew J. Manusharow, Beomseok Choi, Digvijay A. Raorane |
2022-12-13 |
$11,573,000 |
| 11437346 |
Package structure having substrate thermal vent structures for inductor cooling |
Leigh E. Wojewoda, Mathew J. Manusharow, Siddharth Kulasekaran |
2022-09-06 |
$12,766,000 |
| 11380652 |
Multi-level distributed clamps |
Beomseok Choi, Kaladhar Radhakrishnan, William J. Lambert, Krishna Bharath |
2022-07-05 |
$18,093,000 |
| 11357096 |
Package substrate inductor having thermal interconnect structures |
Huong Do, Anne Augustine |
2022-06-07 |
$12,864,000 |
| 11335620 |
Package inductor having thermal solution structures |
Anne Augustine, Huong Do, William J. Lambert |
2022-05-17 |
$14,251,000 |
| 11215662 |
Method, device and system to protect circuitry during a burn-in process |
William J. Lambert, Kaladhar Radhakrishnan |
2022-01-04 |
$22,100,000 |
| 11211866 |
Reconfigurable inductor |
William J. Lambert, Kaladhar Radhakrishnan, Beomseok Choi, Krishna Bharath |
2021-12-28 |
$27,770,000 |
| 11107757 |
Integrated circuit structures in package substrates |
Sanka Ganesan, William J. Lambert, Zhichao Zhang, Sri Chaitra Jyotsna Chavali, Stephen Andrew Smith +1 more |
2021-08-31 |
$22,590,000 |
| 11049119 |
Apparatus and method for dispensing a product in response to detection of a selected facial expression |
Steven E. McLean, Skyler S. Lauren, Justin D. Kovac |
2021-06-29 |
|
| 10672693 |
Integrated circuit structures in package substrates |
Sanka Ganesan, William J. Lambert, Zhichao Zhang, Sri Chaitra Jyotsna Chavali, Stephen Andrew Smith +1 more |
2020-06-02 |
$32,838,000 |
| 10503227 |
Apparatus and method to reduce power losses in an integrated voltage regulator |
Krishna Bharath, Srikrishnan Venkataraman, William J. Lambert, Alexander Slepoy, Dong Zhong +3 more |
2019-12-10 |
$22,400,000 |
| 10159152 |
Development of the advanced component in cavity technology |
Ladd D. Campbell, Scott M. Mokler, Juan Landeros, Jin Zhao |
2018-12-18 |
$25,622,000 |
| 10122209 |
Tunable delay control of a power delivery network |
Ahmed Salama, Srikrishnan Venkataraman, Todd W. Mellinger, Paul K. Tucker, Assaf Benhamou |
2018-11-06 |
$18,970,000 |
| 9753510 |
Apparatus and method to reduce power losses in an integrated voltage regulator |
Krishna Bharath, Srikrishnan Venkataraman, William J. Lambert, Alexander Slepoy, Dong Zhong +3 more |
2017-09-05 |
$9,844,000 |
| 9461431 |
Mechanism for facilitating and employing a magnetic grid array |
Gregorio R. Murtagian, Bhanu Jaiswal, Sriram Srinivasan |
2016-10-04 |
$11,494,000 |
| 9262185 |
Scripted dynamic document generation using dynamic document template scripts |
John Coleman Horton, IV |
2016-02-16 |
$4,807,000 |
| 9230944 |
Techniques and configurations associated with a capductor assembly |
William J. Lambert, Kaladhar Radhakrishnan |
2016-01-05 |
$11,513,000 |
| 9118143 |
Mechanism for facilitating and employing a magnetic grid array |
Gregorio R. Murtagian, Bhanu Jaiswal, Sriram Srinivasan |
2015-08-25 |
$14,120,000 |
| 7692284 |
Package using array capacitor core |
Kimberly D. Eilert, Kaladhar Radhakrishnan, Kemal Aygun |
2010-04-06 |
$11,081,000 |
| 7571197 |
Method and apparatus for synchronizing dataset object properties with underlying database structures |
Barbara A. Christensen, Kenneth L. Reising, John Coleman Horton, IV, Eugene J. Gretter |
2009-08-04 |
$14,100,000 |
| 7361969 |
Controlled equivalent series resistance capacitor |
Kemal Aygun, Kimberly D. Eilert, Kaladhar Radhakrishnan |
2008-04-22 |
$13,499,000 |
| 7324317 |
Control of breakdown voltage for microelectronic packaging |
Weimin Shi |
2008-01-29 |
$16,660,000 |
