Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 12313890 | Through-substrate optical vias | Pooya Tadayon, Zhichao Zhang, Brandon C. Marin, Tarek A. Ibrahim, Kemal Aygun | 2025-05-27 | |
| 12003023 | In-package 3D antenna | Zhenguo Jiang, Omkar G. Karhade, Srichaitra Chavali, Zhichao Zhang, Jimin Yao +2 more | 2024-06-04 | $24,500,000 |
| 11804426 | Integrated circuit structures in package substrates | Sanka Ganesan, William J. Lambert, Zhichao Zhang, Sri Chaitra Jyotsna Chavali, Michael J. Hill +1 more | 2023-10-31 | $30,374,000 |
| 11107757 | Integrated circuit structures in package substrates | Sanka Ganesan, William J. Lambert, Zhichao Zhang, Sri Chaitra Jyotsna Chavali, Michael J. Hill +1 more | 2021-08-31 | $22,590,000 |
| 10672693 | Integrated circuit structures in package substrates | Sanka Ganesan, William J. Lambert, Zhichao Zhang, Sri Chaitra Jyotsna Chavali, Michael J. Hill +1 more | 2020-06-02 | $32,838,000 |