| 12200855 |
Radio frequency front-end structures |
Sidharth Dalmia, William J. Lambert, Kirthika Nahalingam, Swathi Vijayakumar |
2025-01-14 |
| 12003023 |
In-package 3D antenna |
Omkar G. Karhade, Srichaitra Chavali, Zhichao Zhang, Jimin Yao, Stephen Andrew Smith +2 more |
2024-06-04 |
| 11937367 |
Radio frequency front-end structures |
Sidharth Dalmia, William J. Lambert, Kirthika Nahalingam, Swathi Vijayakumar |
2024-03-19 |
| 11804426 |
Integrated circuit structures in package substrates |
Sanka Ganesan, William J. Lambert, Zhichao Zhang, Sri Chaitra Jyotsna Chavali, Stephen Andrew Smith +1 more |
2023-10-31 |
| 11729902 |
Radio frequency front-end structures |
Sidharth Dalmia, William J. Lambert, Kirthika Nahalingam, Swathi Vijayakumar |
2023-08-15 |
| 11611164 |
Wideband multi-pin edge connector for radio frequency front end module |
Omkar G. Karhade, Sri Chaitra Jyotsna Chavali, William J. Lambert, Zhichao Zhang, Mitul Modi |
2023-03-21 |
| 11482471 |
Thermal management solutions for integrated circuit packages |
Cheng Xu, Junnan Zhao, Zhimin Wan, Ying Wang, Yikang Deng +3 more |
2022-10-25 |
| 11107757 |
Integrated circuit structures in package substrates |
Sanka Ganesan, William J. Lambert, Zhichao Zhang, Sri Chaitra Jyotsna Chavali, Stephen Andrew Smith +1 more |
2021-08-31 |
| 10672693 |
Integrated circuit structures in package substrates |
Sanka Ganesan, William J. Lambert, Zhichao Zhang, Sri Chaitra Jyotsna Chavali, Stephen Andrew Smith +1 more |
2020-06-02 |