Issued Patents All Time
Showing 25 most recent of 54 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12362295 | Planar magnetic radial inductors to enable VR disaggregation | — | 2025-07-15 |
| 12363831 | Backside recess in motherboard with thermally conductive mold | Wei Hong Shen | 2025-07-15 |
| 12334242 | Coreless electronic substrates having embedded inductors | Sanka Ganesan, Sri Chaitra Jyotsna Chavali, Robert L. Sankman, Anne Augustine | 2025-06-17 |
| 12308362 | Packaging architecture for disaggregated integrated voltage regulators | Krishna Bharath, William J. Lambert, Adel A. Elsherbini, Sriram Srinivasan, Christopher Schaef | 2025-05-20 |
| 12288750 | Conformal power delivery structure for direct chip attach architectures | William J. Lambert, Beomseok Choi, Krishna Bharath, Adel A. Elsherbini | 2025-04-29 |
| 12242290 | Integrating voltage regulators and passive circuit elements with top side power planes in stacked die architectures | Beomseok Choi, William J. Lambert, Krishna Bharath, Adel A. Elsherbini, Henning Braunisch +3 more | 2025-03-04 |
| 12074514 | Two stage multi-input multi-output regulator | Beomseok Choi, Michael J. Hill | 2024-08-27 |
| 12068684 | Multi-phase switching regulators with hybrid inductors and per phase frequency control | Krishna Bharath, Christopher Schaef, William J. Lambert | 2024-08-20 |
| 11955426 | Package-integrated multi-turn coil embedded in a package magnetic core | Huong Do, Krishna Bharath, Yikang Deng, Amruthavalli Pallavi Alur | 2024-04-09 |
| 11916006 | Microelectronic assemblies having an integrated voltage regulator chiplet | Adel A. Elsherbini, Krishna Bharath, Shawna M. Liff, Johanna M. Swan | 2024-02-27 |
| 11830809 | Magnetic structures in integrated circuit package supports | Ying Wang, Yikang Deng, Junnan Zhao, Andrew J. Brown, Cheng Xu | 2023-11-28 |
| 11735535 | Coaxial magnetic inductors with pre-fabricated ferrite cores | Krishna Bharath, Clive R. Hendricks | 2023-08-22 |
| 11710720 | Integrated multi-die partitioned voltage regulator | Beomseok Choi, Siddharth Kulasekaran | 2023-07-25 |
| 11682613 | Package substrates with magnetic build-up layers | Zhiguo Qian, Kemal Aygun | 2023-06-20 |
| 11676950 | Via-in-via structure for high density package integrated inductor | Krishna Bharath, Sriram Srinivasan, Amruthavalli Pallavi Alur, Huong Do, William J. Lambert | 2023-06-13 |
| 11462463 | Microelectronic assemblies having an integrated voltage regulator chiplet | Adel A. Elsherbini, Krishna Bharath, Shawna M. Liff, Johanna M. Swan | 2022-10-04 |
| 11450560 | Microelectronic assemblies having magnetic core inductors | Krishna Bharath, Adel A. Elsherbini, Shawna M. Liff, Zhiguo Qian, Johanna M. Swan | 2022-09-20 |
| 11437294 | Structures to facilitate heat transfer within package layers to thermal heat sink and motherboard | Sameer Shekhar, Amit Jain, Jonathan P. Douglas, Chin Lee Kuan | 2022-09-06 |
| 11404364 | Multi-layer embedded magnetic inductor coil | Huong Do, Krishna Bharath, Yikang Deng, Amruthavalli Pallavi Alur | 2022-08-02 |
| 11393751 | Package-integrated multi-turn coil embedded in a package magnetic core | Huong Do, Krishna Bharath, Yikang Deng, Amruthavalli Pallavi Alur | 2022-07-19 |
| 11380652 | Multi-level distributed clamps | Beomseok Choi, William J. Lambert, Michael J. Hill, Krishna Bharath | 2022-07-05 |
| 11335616 | Substrate integrated inductor with composite magnetic resin layer | Malavarayan Sankarasubramanian, Yongki Min, Ashay Dani | 2022-05-17 |
| 11215662 | Method, device and system to protect circuitry during a burn-in process | William J. Lambert, Michael J. Hill | 2022-01-04 |
| 11211866 | Reconfigurable inductor | William J. Lambert, Beomseok Choi, Krishna Bharath, Michael J. Hill | 2021-12-28 |
| 11081434 | Package substrates with magnetic build-up layers | Zhiguo Qian, Kemal Aygun | 2021-08-03 |