Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11437346 | Package structure having substrate thermal vent structures for inductor cooling | Michael J. Hill, Mathew J. Manusharow, Siddharth Kulasekaran | 2022-09-06 |
| 10741536 | Magnetic small footprint inductor array module for on-package voltage regulator | Yongki Min, Reynaldo A. Olmedo, William J. Lambert, Kaladhar Radhakrishnan, Venkat Anil K. Magadala +1 more | 2020-08-11 |
| 10340260 | Magnetic small footprint inductor array module for on-package voltage regulator | Yongki Min, Reynaldo A. Olmedo, William J. Lambert, Kaladhar Radhakrishnan, Venkat Anil K. Magadala +1 more | 2019-07-02 |
| 9911723 | Magnetic small footprint inductor array module for on-package voltage regulator | Yongki Min, Reynaldo A. Olmedo, William J. Lambert, Kaladhar Radhakrishnan, Venkat Anil K. Magadala +1 more | 2018-03-06 |
| 6614122 | Controlling underfill flow locations on high density packages using physical trenches and dams | Thomas Dory, HengGee Lee, David W. Young | 2003-09-02 |