Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7282796 | Electronic assembly having a more dense arrangement of contacts that allows for routing of traces to the contacts | Kevin E. Wells, Julius Delino | 2007-10-16 |
| 7247517 | Method and apparatus for a dual substrate package | Christopher L. Rumer | 2007-07-24 |
| 7064431 | Electronic assembly having select spacing of rows and columns of contacts to allow for routing of traces to the contacts | Kevin E. Wells, Julius Delino | 2006-06-20 |
| 6885102 | Electronic assembly having a more dense arrangement of contacts that allows for routing of traces to the contacts | Kevin E. Wells, Julius Delino | 2005-04-26 |
| 6764877 | Method of dissipating static electric charge from a chip assembly during a manufacturing operation | Arthur Lin, Robert A. Anderson | 2004-07-20 |
| 6715663 | Wire-bond process flow for copper metal-six, structures achieved thereby, and testing method | Krishna Seshan | 2004-04-06 |
| 6566741 | Grounding of package substrates | Arthur Lin, Robert A. Anderson | 2003-05-20 |
| 6404067 | Plastic ball grid array package with improved moisture resistance | Joseph C. Barrett | 2002-06-11 |