| 7282796 |
Electronic assembly having a more dense arrangement of contacts that allows for routing of traces to the contacts |
Kevin E. Wells, Julius Delino |
2007-10-16 |
| 7247517 |
Method and apparatus for a dual substrate package |
Christopher L. Rumer |
2007-07-24 |
| 7064431 |
Electronic assembly having select spacing of rows and columns of contacts to allow for routing of traces to the contacts |
Kevin E. Wells, Julius Delino |
2006-06-20 |
| 6885102 |
Electronic assembly having a more dense arrangement of contacts that allows for routing of traces to the contacts |
Kevin E. Wells, Julius Delino |
2005-04-26 |
| 6764877 |
Method of dissipating static electric charge from a chip assembly during a manufacturing operation |
Arthur Lin, Robert A. Anderson |
2004-07-20 |
| 6715663 |
Wire-bond process flow for copper metal-six, structures achieved thereby, and testing method |
Krishna Seshan |
2004-04-06 |
| 6566741 |
Grounding of package substrates |
Arthur Lin, Robert A. Anderson |
2003-05-20 |
| 6404067 |
Plastic ball grid array package with improved moisture resistance |
Joseph C. Barrett |
2002-06-11 |