Patents per Year
Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 7211888 | Encapsulation of pin solder for maintaining accuracy in pin position | — | 2007-05-01 | $14,206,000 |
| 6992891 | Metal ball attachment of heat dissipation devices | Debendra Mallik, Christopher L. Rumer, Jeffrey Winton | 2006-01-31 | $19,938,000 |
| 6974765 | Encapsulation of pin solder for maintaining accuracy in pin position | — | 2005-12-13 | $11,810,000 |
| 6867060 | Wafer-level packaging of electronic devices before singulation | Steve Greathouse | 2005-03-15 | $27,410,000 |
| 6852926 | Packaging microelectromechanical structures | Qing Ma, Valluri Rao, John Heck, Daniel ManHung Wong | 2005-02-08 | $36,565,000 |
| 6025767 | Encapsulated micro-relay modules and methods of fabricating same | Mark D. Kellam | 2000-02-15 | |
| 5459013 | Image reversal method for repairing defective areas on microelectronic substrates | Paul A. Magill | 1995-10-17 |