Patents per Year
Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 7901536 | Resonating conductive traces and methods of using same for bonding components | Zakaryae Fathi, Robert L. Hubbard, Iftikhar Ahmad | 2011-03-08 | |
| 7368808 | MEMS packaging using a non-silicon substrate for encapsulation and interconnection | John Heck, Joseph Hayden, Daniel ManHung Wong | 2008-05-06 | $19,899,000 |
| 6867060 | Wafer-level packaging of electronic devices before singulation | Michele Berry | 2005-03-15 | $27,410,000 |
| 6436318 | Paper substrates for use in integrated circuit packaging molding processes | Jonathan McFarland, Eric Gelvin | 2002-08-20 | $43,289,000 |