Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Paper substrates for use in integrated circuit packaging molding processes

Paper substrates for use in integrated circuit packaging molding processes

US Patent 6436318 · Granted Aug 20, 2002

Estimated economic value: $43,289,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Resonating conductive traces and methods of using same for bonding components2011
Apparatus for coupling a fiber optic cable to an optoelectronic device, a system2009
MEMS packaging using a non-silicon substrate for encapsulation and interconnecti2008
Optical and electrical interconnect2008
Apparatus for coupling a fiber optic cable to an optoelectronic device, a system2006
Apparatus and method of packaging two dimensional photonic array devices2005
Wafer-level packaging of electronic devices before singulation2005
Apparatus for coupling an optoelectronic device to a fiber optic cable and a mic2005
Optical and electrical interconnect2005