| 9859248 |
Laser die backside film removal for integrated circuit (IC) packaging |
Danish Faruqui, Edward R. Prack, David K. Wilkinson, JR., Tony Dambrauskas, Lars D. Skoglund +3 more |
2018-01-02 |
| 9472505 |
Die or substrate marking using a laser |
Frank G. Evans, Shipeng Qiu, Dhruv Bhate, Tao Wang |
2016-10-18 |
| 9430685 |
Substrate markings |
Rose Mulligan, Sarita Evans |
2016-08-30 |
| 9412702 |
Laser die backside film removal for integrated circuit (IC) packaging |
Danish Faruqui, Edward R. Prack, David K. Wilkinson, JR., Tony Dambrauskas, Lars D. Skoglund +3 more |
2016-08-09 |
| 8525136 |
Work piece with concealed surface defects |
— |
2013-09-03 |
| 8426250 |
Laser-assisted chemical singulation of a wafer |
George Vakanas, George Chen, Yuval Greenzweig, Eric J. Li |
2013-04-23 |
| 8173552 |
Method of fabricating an identification mark utilizing a liquid film assisted by a laser |
George Vakanas, Luey Chon Ng, George E. Malouf |
2012-05-08 |
| 8076776 |
Integrated circuit package having security feature and method of manufacturing same |
Dhruv Bhate |
2011-12-13 |
| 7985957 |
Methods for concealing surface defects |
— |
2011-07-26 |
| 7807573 |
Laser assisted chemical vapor deposition for backside die marking and structures formed thereby |
Eric J. Li |
2010-10-05 |
| 7611966 |
Dual pulsed beam laser micromachining method |
Eric J. Li, Christopher L. Rumer |
2009-11-03 |
| 7303977 |
Laser micromachining method |
Christopher L. Rumer |
2007-12-04 |
| 7169687 |
Laser micromachining method |
Eric J. Li, Christopher L. Rumer |
2007-01-30 |
| 6661876 |
Mobile miniature X-ray source |
Clark Turner, Arturo Reyes, Hans K. Pew, Mark W. Lund, Michael Lines +1 more |
2003-12-09 |