Issued Patents All Time
Showing 26–50 of 52 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7195951 | Carbon-carbon and/or metal-carbon fiber composite heat spreaders | Sabina J. Houle, Greg M. Chrysler | 2007-03-27 |
| 7180174 | Nanotube modified solder thermal intermediate structure, systems, and methods | Bryan M. White | 2007-02-20 |
| 7168484 | Thermal interface apparatus, systems, and methods | Yuegang Zhang, C. Garner, Andrew Berlin, Valluri Rao, Bryan M. White | 2007-01-30 |
| 7169650 | Semi-solid metal injection methods for electronic assembly thermal interface | Agostino C. Rinella | 2007-01-30 |
| 7136275 | Polymeric dielectric material for high-energy density capacitors | Paul H. Wermer | 2006-11-14 |
| 7126215 | Microelectronic packages including nanocomposite dielectric build-up materials and nanocomposite solder resist | James C. Matayabas, Jr. | 2006-10-24 |
| 7059048 | Wafer-level underfill process making use of sacrificial contact pad protective material | Terry Sterrett | 2006-06-13 |
| 7036573 | Polymer with solder pre-coated fillers for thermal interface materials | Fay Hua, Carl Deppisch | 2006-05-02 |
| 6981380 | Thermoelectric cooling for microelectronic packages and dice | Gregory M. Chrysler, Saikumar Jayaraman, Makarem A. Hussein | 2006-01-03 |
| 6982492 | No-flow underfill composition and method | Christopher L. Rumer, Tian-An Chen, Vijay Wakharkar | 2006-01-03 |
| 6974723 | Gel thermal interface materials comprising fillers having low melting point and electronic packages comprising these gel thermal interface materials | James C. Matayabas, Jr., Ashay Dani, Christopher L. Rumer | 2005-12-13 |
| 6926955 | Phase change material containing fusible particles as thermally conductive filler | Saikumar Jayaraman, Ashay Dani | 2005-08-09 |
| 6924027 | Phase change thermal interface materials including exfoliated clay | James C. Matayabas, Jr. | 2005-08-02 |
| 6841867 | Gel thermal interface materials comprising fillers having low melting point and electronic packages comprising these gel thermal interface materials | James C. Matayabas, Jr., Ashay Dani, Christopher L. Rumer | 2005-01-11 |
| 6837306 | Carbon-carbon and/or metal-carbon fiber composite heat spreaders | Sabina J. Houle, Greg M. Chrysler | 2005-01-04 |
| 6813153 | Polymer solder hybrid | Fay Hua | 2004-11-02 |
| 6787899 | Electronic assemblies with solidified thixotropic thermal interface material | Agostino C. Rinella | 2004-09-07 |
| 6597575 | Electronic packages having good reliability comprising low modulus thermal interface materials | James C. Matayabas, Jr., Jinlin Wang | 2003-07-22 |
| 6489185 | Protective film for the fabrication of direct build-up layers on an encapsulated die package | Steven Towle | 2002-12-03 |
| 6480370 | Polymeric dielectric material for high-energy density capacitors | Paul H. Wermer | 2002-11-12 |
| 6469381 | Carbon-carbon and/or metal-carbon fiber composite heat spreader | Sabina J. Houle, Greg M. Chrysler | 2002-10-22 |
| 6365973 | Filled solder | — | 2002-04-02 |
| 6020455 | Vinyl cyclohexanediol containing resin compositions | Wayne R. Pretzer, Matthew A. Kulzick, Asare Nkansah, Maria Curry-Nkansah | 2000-02-01 |
| 5525426 | Poly(vinylalkylether)-containing hot-melt adhesives for polyethylene and polypropylene | Matthew A. Kulzick, Wayne R. Pretzer, Tsuei-Yun Lynch | 1996-06-11 |
| 5393856 | Liquid phase and aqueous solutions of poly(vinyl methyl ether) from highly purified vinyl methyl ether monomer | Matthew A. Kulzick | 1995-02-28 |